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General High-Speed Amplifier Design Considerations

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General

1.11 General High-Speed Amplifier Design Considerations

The THS4082 EVM layout has been designed and optimized for use with
high-speed signals and can be used as an example when designing THS4082
applications. Careful attention has been given to component selection,
grounding, power supply bypassing, and signal path layout. Disregard of these
basic design considerations could result in less than optimum performance of
the THS4082 high-speed, low-power operational amplifier.

Surface-mount components were selected because of the extremely low lead
inductance associated with this technology. Also, because surface-mount
components are physically small, the layout can be very compact. This helps
minimize both stray inductance and capacitance.

Tantalum power supply bypass capacitors (C1 and C2) at the power input pads
help supply currents for rapid, large signal changes at the amplifier output. The
0.1-

µ

F power supply bypass capacitors (C4 and C5) were placed as close as

possible to the IC power input pins in order to keep the PCB trace inductance
to a minimum. This improves high-frequency bypassing and reduces
harmonic distortion.

A proper ground plane on both sides of the PCB should always be used with
high-speed circuit design. This provides low-inductive ground connections for
return current paths. In the area of the amplifier IC input pins, however, the
ground plane was removed to minimize stray capacitance and reduce ground
plane noise coupling into these pins. This is especially important for the
inverting pin while the amplifier is operating in the noninverting mode. Because
the voltage at this pin swings directly with the noninverting input voltage, any
stray capacitance would allow currents to flow into the ground plane, causing
possible gain error and/or oscillation. Capacitance variations at the amplifier
IC input pin of less than 1 pF can significantly affect the response of the
amplifier.

In general, it is always best to keep signal lines as short and as straight as
possible. Round corners or a series of 45

°

 bends should be used instead of

sharp 90

°

 corners. Stripline techniques should also be incorporated when

signal lines are greater than 1 inch in length. These traces should be designed
with a characteristic impedance of either 50 

 or 75 

, as required by the

application. Such signal lines should also be properly terminated with an
appropriate resistor.

Finally, proper termination of all inputs and outputs should be incorporated into
the layout. Unterminated lines, such as coaxial cable, can appear to be a
reactive load to the amplifier IC. By terminating a transmission line with its
characteristic impedance, the amplifier’s load then appears to be purely
resistive and reflections are absorbed at each end of the line. Another
advantage of using an output termination resistor is that capacitive loads are
isolated from the amplifier output. This isolation helps minimize the reduction
in amplifier phase-margin and improves the amplifier stability for improved
performance such as reduced peaking and settling times.

Summary of Contents for THS4082

Page 1: ...September 2000 Mixed Signal Products User s Guide SLOU075...

Page 2: ...this warranty Specific testing of all parameters of each device is not necessarily performed except those mandated by government requirements Customers are responsible for their applications using TI...

Page 3: ...and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules which are designed to provide reasonab...

Page 4: ...iv...

Page 5: ...THS4082 EVM Differential Input 1 10 1 7 1 Differential Input Noninverting Operation 1 10 1 7 2 Differential Input Inverting Operation 1 11 1 8 Using the THS4082 EVM With Differential Inputs 1 14 1 9...

Page 6: ...c Differential Input Inverting Operation 1 12 1 6 THS4082 EVM Frequency Response With Gain 2 1 15 1 7 THS4082 EVM Phase Response With Gain 2 1 15 1 8 PowerPAD PCB Etch and Via Pattern 1 17 1 9 Maximum...

Page 7: ...and thermal considerations Topic Page 1 1 Feature Highlights 1 2 1 2 Description 1 3 1 3 THS4082 EVM Noninverting Operation 1 4 1 4 Using the THS4082 EVM in the Noninverting Mode 1 6 1 5 THS4082 EVM...

Page 8: ...75 MHz 3 dB at 15 VCC Gain 2 5 V to 15 V Operation Noninverting Single Ended Inputs Inverting Capable Through Com ponent Change Module Gain Set to 2 Noninverting Adjustable Through Component Change N...

Page 9: ...XAS R2 R3 R4 R5 R6 C3 R7 C5 C4 R8 R9 R10 R11 R12 R13 R14 C6 R15 J5 VOUT2 J1 VIN1 J4 VIN2 Note The EVM is shipped with the following component locations empty C3 C6 R2 R4 R8 R10 and R12 Although the TH...

Page 10: ...3 R3 0 R5 1 k R6 1 k VCC C3 x F R7 49 9 VOUT1 J3 C4 0 1 F VCC J1 VIN1 R1 49 9 U1 B THS4082 7 6 5 R11 0 R13 1 k R14 1 k C6 x F R15 49 9 VOUT2 J5 J4 VIN2 R9 49 9 C5 0 1 F The gain of the EVM can easily...

Page 11: ...VM output will divide the output signal level by a factor of 2 assuming the output isolation resistor on the EVM board remains 50 Similar effects can occur at the input depending upon how the input si...

Page 12: ...cations marked VCC and VCC 4 Connect an oscilloscope to the module SMA output connector J3 J5 through a 50 nominal impedance cable an oscilloscope having a 50 input termination is preferred for examin...

Page 13: ...to the R4 location on the board 2 Move resistor R11 to the R10 location and R13 to the R12 location on the board This configuration is shown in Figure 1 3 Note Compensation capacitors C3 and C6 are n...

Page 14: ...dance with the following equations R1 R4 RT R4 RT Channel 1 and R9 R12 RT R4 RT Channel 2 where RT is the source impedance Any of the resistors on the EVM board can be replaced with a resistor of a di...

Page 15: ...he module terminal block J2 locations marked VCC and VCC 4 Connect an oscilloscope to the module SMA output connector J3 J5 through a 50 nominal impedance cable an oscilloscope having a 50 input termi...

Page 16: ...adding a resistor on the board 1 Remove resistors R1 and R9 2 Add a 100 resistor to the R8 location on the board This configuration noninverting is shown in Figure 1 4 For a noninverting differential...

Page 17: ...2 assuming the output isolation resistor on the EVM board remains 50 Similar effects can occur at the input depending upon how the input signal sources are configured The gain equations given above as...

Page 18: ...nputs can easily be changed to support a particular application by simply changing the ratio of resistors R6 and R4 channel 1 and R14 and R12 channel 2 as described in the following equation Inverting...

Page 19: ...M output will divide the output signal level by a factor of 2 assuming the output isolation resistor on the EVM board remains 50 Similar effects can occur at the input depending upon how the input sig...

Page 20: ...ing a 50 input termination is preferred for examining very high frequency signals 5 Set the power supply to ON 6 Connect the differential signal input across the module SMA input connec tors J1 and J4...

Page 21: ...r supply and a 5 V power supply Figure 1 6 THS4082 EVM Frequency Response With Gain 2 f Frequency Hz 1 0 1 2 3 4 5 6 7 Output Amplitude dB 100k 1G 1M VCC 5 V and 15 V VI 0 1 VRMS RL 100 100M 10M Figur...

Page 22: ...imize stray capacitance and reduce ground plane noise coupling into these pins This is especially important for the inverting pin while the amplifier is operating in the noninverting mode Because the...

Page 23: ...cking through the holes is not a problem during reflow 3 Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area This helps dissipate the heat generated by the T...

Page 24: ...re PD Maximum power dissipation of THS4082 IC watts TMAX Absolute maximum junction temperature 150 C TA Free ambient air temperature C JA JC CA JC Thermal coefficient from junction to case 4 7 C W for...

Page 25: ...ls on proper board layout can be found in the THS4081 THS4082 175 MHz Low Power High Speed Amplifiers data sheet literature number SLOS274 For more general information on the PowerPAD package and its...

Page 26: ...1 20 General...

Page 27: ...a complete schematic parts list and PCB layout illustrations for the THS4082 EVM Topic Page 2 1 THS4082 EVM Complete Schematic 2 2 2 2 THS4082 Dual High Speed Operational Amplifier EVM Parts List 2 3...

Page 28: ...lue of X are not supplied on the board but can be installed by the user to reconfigure the EVM for noninverting and or differential operation Figure 2 1 THS4082 EVM Schematic C1 6 8 F VCC 1 GND 2 VCC...

Page 29: ...re Tech Digi Key ED1515 ND J1 J3 J4 J5 Connector SMA 50 vertical PC mount through hole Amphenol ARF1205 ND R1 R7 R9 R15 Resistor 49 9 1 1 8 W SM 1206 R5 R6 R13 R14 Resistor 1 k 1 1 8 W SM 1206 R3 R11...

Page 30: ...in the following illustrations They are not to scale and appear here only as a reference Figure 2 2 THS4082 EVM Component Placement Silkscreen and Solder Pads VCC C1 C2 VCC U1 J2 GND R1 J3 VOUT1 SLOP...

Page 31: ...THS4082 EVM Board Layouts 2 5 Reference Figure 2 3 THS4082 EVM PC Board Layout Component Side...

Page 32: ...THS4082 EVM Board Layouts 2 6 Reference Figure 2 4 THS4082 EVM PC Board Layout Back Side...

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