background image

MSP430G2231-Q1

SLAS787B – NOVEMBER 2011 – REVISED MARCH 2014

www.ti.com

11.1.1.3.3

Command-Line Programmer

MSP430 Flasher

is an open-source, shell-based interface for programming MSP430 microcontrollers through a

FET programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP430 Flasher can be used to
download binary files (.txt or .hex) files directly to the MSP430 Flash without the need for an IDE.

11.1.1.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's

Terms of

Use

.

TI E2E Community

TI's Engineer-to-Engineer (E2E) Community

. Created to foster collaboration among engineers. At e2e.ti.com, you

can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.

TI Embedded Processors Wiki

Texas Instruments Embedded Processors Wiki

. Established to help developers get started with embedded

processors from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.

11.1.2 Device and Development Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
MSP430™ MCU devices and support tools. Each MSP430™ MCU commercial family member has one of three
prefixes: MSP, PMS, or XMS (for example, MSP430F5259). Texas Instruments recommends two of three
possible prefix designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of
product development from engineering prototypes (with XMS for devices and MSPX for tools) through fully
qualified production devices and tools (with MSP for devices and MSP for tools).

Device development evolutionary flow:

XMS

– Experimental device that is not necessarily representative of the final device's electrical specifications

PMS

– Final silicon die that conforms to the device's electrical specifications but has not completed quality and

reliability verification

MSP

– Fully qualified production device

Support tool development evolutionary flow:

MSPX

– Development-support product that has not yet completed Texas Instruments internal qualification

testing.

MSP

– Fully-qualified development-support product

XMS and PMS devices and MSPX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices and MSP development-support tools have been characterized fully, and the quality and reliability of
the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS and PMS) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, PZP) and temperature range (for example, T).

Figure 17

provides a legend for reading the

complete device name for any family member.

42

Submit Documentation Feedback

Copyright © 2011–2014, Texas Instruments Incorporated

Product Folder Links:

MSP430G2231-Q1

Summary of Contents for MSP430G2231

Page 1: ...ency LF timer and ten I O pins The MSP430G2231 devices Oscillator have a 10 bit A D converter and built in communication capability using synchronous 32 kHz Crystal protocols SPI or I2C For configurat...

Page 2: ...s P1 x 8 Spy Bi Wire XIN XOUT RAM 128B Flash 2KB ADC 10 Bit 8 Ch Autoscan 1 ch DMA P2 x Port P2 2 I O Interrupt capability pullup down resistors 2 USI Universal Serial Interface SPI I2C MSP430G2231 Q1...

Page 3: ...ut Output With 9 2 Recommended Operating Conditions 16 Schmitt Trigger 34 9 3 Active Mode Supply Current Into VCC Excluding 10 3 Port P1 Pin Schematic P1 4 Input Output With External Current 17 Schmit...

Page 4: ...on related to operation at 105 C SLAS787B Removed all device variants except for MSP430G2231 Added Device and Documentation Support and Mechanical Packaging and Orderable Information 6 Device Characte...

Page 5: ...OUT P2 7 13 XIN P2 6 TA0 1 14 DVSS P1 0 TA0CLK ACLK A0 P1 1 TA0 0 A1 P1 2 TA0 1 A2 P1 3 ADC10CLK A3 VREF VEREF P1 4 SMCLK A4 VREF VEREF TCK P1 5 TA0 0 A5 SCLK TMS MSP430G2231 Q1 www ti com SLAS787B NO...

Page 6: ...mer0_A capture CCI1A input compare Out1 output A6 ADC10 analog input A6 8 7 I O SDO USI Data output in SPI mode SCL USI I2C clock in I2C mode TDI TCLK JTAG test data input or test clock input during p...

Page 7: ...rpose registers Peripherals are connected to the CPU using data address and control buses and can be handled with all instructions The instruction set consists of the original 51 instructions with thr...

Page 8: ...K and SMCLK remain active MCLK is disabled Low power mode 1 LPM1 CPU is disabled ACLK and SMCLK remain active MCLK is disabled DCO s dc generator is disabled if DCO not used in active mode Low power m...

Page 9: ...tchdog Timer WDTIFG maskable 0FFF4h 26 Timer_A2 TACCR0 CCIFG 4 maskable 0FFF2h 25 Timer_A2 TACCR1 CCIFG TAIFG 2 4 maskable 0FFF0h 24 0FFEEh 23 0FFECh 22 ADC10 ADC10IFG 4 5 maskable 0FFEAh 21 USI USIIF...

Page 10: ...if watchdog mode is selected Active if Watchdog Timer is configured in interval timer mode OFIE Oscillator fault interrupt enable NMIIE Non maskable interrupt enable ACCVIE Flash access violation int...

Page 11: ...flash memory Features of the flash memory include Flash memory has n segments of main memory and four segments of information memory A to D of 64 bytes each Each segment in main memory is 512 bytes in...

Page 12: ...y In Flash Information Memory Segment A CALIBRATION DCO FREQUENCY SIZE ADDRESS REGISTER CALBC1_1MHZ byte 010FFh 1 MHz CALDCO_1MHZ byte 010FEh 8 8 2 Brownout The brownout circuit is implemented to prov...

Page 13: ...0 TACLK INCLK 3 P1 1 2 P1 1 TA0 CCI0A 3 P1 1 2 P1 1 ACLK internal CCI0B 7 P1 5 6 P1 5 CCR0 TA0 VSS GND VCC VCC 4 P1 2 3 P1 2 TA1 CCI1A 4 P1 2 3 P1 2 8 P1 6 7 P1 6 TA1 CCI1B 8 P1 6 7 P1 6 CCR1 TA1 VSS...

Page 14: ...e 12 Peripherals With Byte Access REGISTER MODULE REGISTER DESCRIPTION OFFSET NAME ADC10 ADC analog enable ADC10AE0 04Ah ADC data transfer control 1 ADC10DTC1 049h ADC data transfer control 0 ADC10DTC...

Page 15: ...interrupt enable P1IE 025h Port P1 interrupt edge select P1IES 024h Port P1 interrupt flag P1IFG 023h Port P1 direction P1DIR 022h Port P1 output P1OUT 021h Port P1 input P1IN 020h Special Function S...

Page 16: ...ST pin when blowing the JTAG fuse 3 Higher temperature may be applied during board soldering according to the current JEDEC J STD 020 specification with peak reflow temperatures not higher than classi...

Page 17: ...IT fDCO fMCLK fSMCLK 1 MHz 2 2 V 220 fACLK 32768 Hz Program executes in flash Active mode AM IAM 1MHz BCSCTL1 CALBC1_1MHZ A current 1 MHz 3 V 300 370 DCOCTL CALDCO_1MHZ CPUOFF 0 SCG0 0 SCG1 0 OSCOFF 0...

Page 18: ...SCG0 0 SCG1 1 OSCOFF 0 fDCO fMCLK fSMCLK 0 MHz Low power mode 3 fACLK 32768 Hz ILPM3 LFXT1 25 C 2 2 V 0 7 1 5 A LPM3 current 4 CPUOFF 1 SCG0 1 SCG1 1 OSCOFF 0 fDCO fMCLK fSMCLK 0 MHz Low power mode 3...

Page 19: ...d individually The port pin is selected for input and the pullup pulldown resistor is disabled 9 9 Outputs Ports Px over recommended ranges of supply voltage and operating free air temperature unless...

Page 20: ...5 3 3 5 VCC 3 V P1 7 TA 25 C TA 85 C OL I Typical Low Level Output Current mA MSP430G2231 Q1 SLAS787B NOVEMBER 2011 REVISED MARCH 2014 www ti com 9 11 Typical Characteristics Outputs over recommended...

Page 21: ...0 mV td BOR See Figure 11 2000 s Pulse duration needed at RST NMI pin to t reset 2 2 V 3 V 2 s accepted reset internally 1 The current consumption of the brownout module is already included in the ICC...

Page 22: ...tr Typical Conditions VCC 3 V MSP430G2231 Q1 SLAS787B NOVEMBER 2011 REVISED MARCH 2014 www ti com Figure 13 VCC drop Level With a Triangle Voltage Drop to Generate a POR or BOR Signal 22 Submit Docum...

Page 23: ...fDCO 3 3 DCO frequency 3 3 RSELx 3 DCOx 3 MODx 0 3 V 0 30 MHz fDCO 4 3 DCO frequency 4 3 RSELx 4 DCOx 3 MODx 0 3 V 0 41 MHz fDCO 5 3 DCO frequency 5 3 RSELx 5 DCOx 3 MODx 0 3 V 0 58 MHz fDCO 6 3 DCO f...

Page 24: ...is the frequency change from the measured frequency at 30 C over temperature 9 16 Wakeup From Lower Power Modes LPM3 LPM4 Electrical Characteristics over recommended ranges of supply voltage and oper...

Page 25: ...used ensure that it does not induce capacitive or resistive leakage between the oscillator pins g Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in ot...

Page 26: ...ly voltage and operating free air temperature unless otherwise noted PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT External SCLK fUSI USI clock frequency Duty cycle 50 10 fSYSTEM MHz SPI slave mode U...

Page 27: ...V 1 1 1 4 mA current with ADC10SR 0 4 REF2_5V 0 REFOUT 1 ADC10SR 0 fADC10CLK 5 0 MHz Reference buffer supply ADC10ON 0 REFON 1 IREFB 1 3 V 0 5 0 7 mA current with ADC10SR 1 4 REF2_5V 0 REFOUT 1 ADC10...

Page 28: ...00 A Analog input voltage VAx 0 75 V 2 REF2_5V 0 VREF load regulation 3 V LSB IVREF 500 A 100 A Analog input voltage VAx 1 25 V 2 REF2_5V 1 IVREF 100 A 900 A VREF load regulation VAx 0 5 VREF 3 V 400...

Page 29: ...ample and conversion period with REBURST 1 4 The accuracy limits the maximum negative external reference voltage Higher reference voltage levels may be applied with reduced accuracy requirements 5 The...

Page 30: ...des the sensor on time tSENSOR on 4 No additional current is needed The VMID is used during sampling 5 The on time tVMID on is included in the sampling time tVMID sample no additional on time is neede...

Page 31: ...Spy Bi Wire return to normal operation time 2 2 V 3 V 15 100 s 2 2 V 0 5 MHz fTCK TCK input frequency 2 3 V 0 10 MHz RInternal Internal pulldown resistance on TEST 2 2 V 3 V 25 60 90 k 1 Tools that ac...

Page 32: ...dge Select PxSEL y PxIES y PxIFG y Direction 0 Input 1 Output PxDIR y PxSEL y 0 1 ADC10AE0 y MSP430G2231 Q1 SLAS787B NOVEMBER 2011 REVISED MARCH 2014 www ti com 10 I O Port Schematics 10 1 Port P1 Pin...

Page 33: ...N NAME P1 x x FUNCTION ADC10AE x P1DIR x P1SEL x INCH y 1 P1 0 P1 x I O I 0 O 1 0 0 TA0CLK TA0 TACLK 0 1 0 0 ACLK ACLK 1 1 0 A0 A0 X X 1 y 0 P1 1 P1 x I O I 0 O 1 0 0 TA0 0 TA0 0 1 1 0 1 TA0 CCI0A 0 1...

Page 34: ...0AE0 y MSP430G2231 Q1 SLAS787B NOVEMBER 2011 REVISED MARCH 2014 www ti com 10 2 Port P1 Pin Schematic P1 3 Input Output With Schmitt Trigger Table 14 Port P1 P1 3 Pin Functions CONTROL BITS OR SIGNALS...

Page 35: ...31 Q1 www ti com SLAS787B NOVEMBER 2011 REVISED MARCH 2014 10 3 Port P1 Pin Schematic P1 4 Input Output With Schmitt Trigger Table 15 Port P1 P1 4 Pin Functions CONTROL BITS OR SIGNALS PIN NAME P1 x x...

Page 36: ...S787B NOVEMBER 2011 REVISED MARCH 2014 www ti com 10 4 Port P1 Pin Schematic P1 5 Input Output With Schmitt Trigger Table 16 Port P1 P1 5 Pin Functions CONTROL BITS OR SIGNALS PIN NAME P1 x x FUNCTION...

Page 37: ...is disabled in JTAG mode MSP430G2231 Q1 www ti com SLAS787B NOVEMBER 2011 REVISED MARCH 2014 10 5 Port P1 Pin Schematic P1 6 Input Output With Schmitt Trigger Table 17 Port P1 P1 6 Pin Functions CONTR...

Page 38: ...drives low level only Driver is disabled in JTAG mode MSP430G2231 Q1 SLAS787B NOVEMBER 2011 REVISED MARCH 2014 www ti com 10 6 Port P1 Pin Schematic P1 7 Input Output With Schmitt Trigger Table 18 Po...

Page 39: ...PxSEL 6 0 1 MSP430G2231 Q1 www ti com SLAS787B NOVEMBER 2011 REVISED MARCH 2014 10 7 Port P2 Pin Schematic P2 6 Input Output With Schmitt Trigger Table 19 Port P2 P2 6 Pin Functions CONTROL BITS OR S...

Page 40: ...ut 1 Output PxDIR y PxSEL 7 0 1 from P2 6 XIN MSP430G2231 Q1 SLAS787B NOVEMBER 2011 REVISED MARCH 2014 www ti com 10 8 Port P2 Pin Schematic P2 7 Input Output With Schmitt Trigger Table 20 Port P2 P2...

Page 41: ...SP TS430PW28A 11 1 1 2 2 Experimenter Boards Experimenter Boards and Evaluation kits are available for some MSP430 devices These kits feature additional hardware components and connectivity for full s...

Page 42: ...resent evolutionary stages of product development from engineering prototypes with XMS for devices and MSPX for tools through fully qualified production devices and tools with MSP for devices and MSP...

Page 43: ...mily Series Optional Temperature Range 430 MCU Platform Packaging Device Type Optional A Revision Optional Tape and Reel Feature Set Optional Additional Features MSP430G2231 Q1 www ti com SLAS787B NOV...

Page 44: ...s have limited built in ESD protection The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates 11 6 Glo...

Page 45: ...solder bumps used between the die and package or 2 lead based die adhesive used between the die and leadframe The component is otherwise considered Pb Free RoHS compatible as defined above Green RoHS...

Page 46: ...tal purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis OTHER QUALIFIED VERSIONS OF MSP430G2231 Q1 Catalog MSP430G2231 Enhanced Product MSP430G2231 EP N...

Page 47: ...Reel Diameter mm Reel Width W1 mm A0 mm B0 mm K0 mm P1 mm W mm Pin1 Quadrant MSP430G2231IPW4RQ1 TSSOP PW 14 2000 330 0 12 4 6 9 5 6 1 6 8 0 12 0 Q1 MSP430G2231IRSARQ1 QFN RSA 16 3000 330 0 12 4 4 25...

Page 48: ...e Type Package Drawing Pins SPQ Length mm Width mm Height mm MSP430G2231IPW4RQ1 TSSOP PW 14 2000 367 0 367 0 35 0 MSP430G2231IRSARQ1 QFN RSA 16 3000 367 0 367 0 35 0 PACKAGE MATERIALS INFORMATION www...

Page 49: ......

Page 50: ......

Page 51: ......

Page 52: ......

Page 53: ......

Page 54: ...sponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related inf...

Reviews: