Processor Family
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
430 MCU Platform
TI’s Low-Power Microcontroller Platform
Device Type
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
Bluetooth
Series
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz with LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz with LCD
0 = Low-Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
N/A
Optional: Temperature Range
S = 0°C to 50 C
C to 70 C
I = 40 C to 85 C
T = –40 C to 105 C
°
C = 0°
°
–
°
°
°
°
Packaging
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional: Additional Features
-EP = Enhanced Product ( 40°C to 105°C)
-HT = Extreme Temperature Parts ( 55°C to 150°C)
-Q1 = Automotive Q100 Qualified
–
–
MSP
430
F
5
438
A
I
ZQW
T
-EP
Processor Family
Series
Optional: Temperature Range
430 MCU Platform
Packaging
Device Type
Optional: A = Revision
Optional: Tape and Reel
Feature Set
Optional: Additional Features
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
MSP devices and MSP development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS and PMS) have a greater failure rate than the standard
production devices. TI recommends that these devices not be used in any production system because
their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PZP) and temperature range (for example, T).
Figure 7-1
provides a legend
for reading the complete device name for any family member.
Figure 7-1. Device Nomenclature
Copyright © 2009–2015, Texas Instruments Incorporated
Device and Documentation Support
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Product Folder Links:
MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Summary of Contents for MSP430F5527
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