www.ti.com
4
Physical Description
4.1
PCB Layout
K001
Physical Description
This chapter describes the physical characteristics and PCB layout of the EVM.
The EVM comprises six layers and is 62 mils thick. The EVM features a split ground plane, which can be
shorted together under the ADC by using the two exposed gold-plated strips seen in
Figure 8
to make a
low-impedance connection between ground planes. By default, the ground planes are not connected
together and should be connected at the power supply. Although this board uses separate ground planes
between analog and digital supplies, it should be noted that TI has conducted experiments with both
single and split ground planes and found the performance to be identical. The ADC features a
constant-current LVDS output, which minimizes the coupling of digital output switching noise back to the
analog inputs.
Figure 4. Layer 1, Top Silkscreen
SLAU196 – April 2007
13
Submit Documentation Feedback