
GE865 Hardware User Guide
1vv0300799 Rev.9 – 27-07-2009
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 60 of 70
13.4 Debug of the GE865 in production
To test and debug the mounting of the GE865, we strongly recommend to foreseen test
pads on the host PCB, in order to check the connection between the GE865 itself and the
application and to test the performance of the module connecting it with an external
computer. Depending by the customer application, these pads include, but are not limited to
the following signals:
•
TXD
•
RXD
•
ON/OFF
•
RESET
•
GND
•
VBATT
•
TX_AUX
•
RX_AUX
•
PWRMON
•
SERVICE
13.5 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest
a thickness of stencil foil
≥
120µm.