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Z-Active Differential Probe Family User Manual
43
Probe Applications
The following are representative applications where the Z-Active
Differential Probe Family characteristics enable measurements with
good signal fidelity. Refer to
Z-Active: A New High Performance
Probe Architecture
document (2FW--17826--X, at www.tektro-
nix.com) or the CD for an in-depth discussion of these applications.
Dual In-line Memory Module (DIMM) Testing
H
Solder a group of Tip-Clip assemblies to the circuit board and
leave them in place on critical signal measurement locations.
(The DIMMs are then inserted into the motherboard sockets).
H
Attach one or more probes to the Tip-Clip assemblies and probe
the critical measurement nodes. See Figure 20.
Figure 20: Circuit board with Tip-Clip assemblies