Supermicro SUPERSERVER 6011L, User Manual, Page: 40 / 112

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2. Attaching heat sinks to the processors:
Two passive heat sinks (one for each processor) have been included
with your SuperServer 6011L. Secure a heat sink to each processor
with a suitable thermal compound to best conduct the heat from the
processor to the heat sink. Make sure that you apply the compound
evenly and that good contact is made between the CPU chip (the die) and
the heat sink. Insufficient contact or improper types of heat sinks and
thermal compounds can cause the processor to overheat, which may
crash the system.
3. Removing the processors:
To remove the processors from the motherboard, simply follow the
installation process in reverse order.
Figure 5-3. FCPGA Socket: Empty and with Processor Installed
(low power Pentium III shown)