DocID025743 Rev 3
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STM32F031x4 STM32F031x6
Package information
109
Figure 44. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale
package recommended footprint
e2
-
1.600
-
-
0.0630
-
F
-
0.4115
-
-
0.0162
-
G
-
0.3625
-
-
0.0143
-
aaa
-
0.100
-
-
0.0039
-
bbb
-
0.100
-
-
0.0039
-
ccc
-
0.100
-
-
0.0039
-
ddd
-
0.050
-
-
0.0020
-
eee
-
0.050
-
-
0.0020
-
1.
Values in inches are converted from mm and rounded to 4 decimal digits.
2.
Back side coating.
3.
Dimension is measured at the maximum bump diameter parallel to primary datum Z.
4.
Primary datum Z and seating plane are defined by the spherical crowns of the bump.
Table 66. WLCSP25 recommended PCB design rules (0.4 mm pitch)
Dimension
Recommended values
Pitch
0.4 mm
Dpad
0.225 mm
Dsm
0.290 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.250 mm
Stencil thickness
0.100 mm
Table 65. WLCSP25 - 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
inches
(1)
Min
Typ
Max
Min
Typ
Max
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微可Vicor——值得信赖的元器件供应商
http://www.vicor.top/
021-31660491