XDP-PK1000
2
ABOUT THE REPAIRING OF XA-C100IP
The disassembled repair is not done to XA-C100IP.
When this unit is defective, exchange the assembly parts.
However, only the covers of the sucker can be exchanged with
single.
Refer to page 29.
NOTE OF REPLACING THE IC703 ON THE DSP
BOARD (XDP-MU100)
IC703 on the DSP board cannot exchange with single. When this
part is damaged, exchange the complete mounted board.
NOTE OF OPERATION CONFIRMING (XDP-MU100)
Do either of following connection, and input the audio signal to
this unit when you con
fi
rm the operation.
• Car audio unit is connected with [HIGH LEVEL INPUT] con-
nector (CN402) on DSP board, and the audio signal is input.
XDP-MU100
[HIGH LEVEL INPUT] connector
(CN402 on DSP board)
car audio unit
• iPod or iPhone is installed in XA-C100IP, it is connected with
[CRADLE] connector (CN301) on DSP board, and the audio
signal is input.
XDP-MU100
[CRADLE] connector
(CN301 on DSP board)
XA-C100IP
iPod or iPhone
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(
Caution:
Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution:
The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to
fl
ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SECTION 1
SERVICING NOTES
1.
SERVICING NOTES
............................................. 2
2. GENERAL
.................................................................. 3
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 6
3-2. Bracket
(Bottom)
............................................................ 6
3-3. DSP Board Block ............................................................ 7
3-4. DSP
Board....................................................................... 7
4.
TEST MODE
............................................................ 8
5. DIAGRAMS
5-1. Block
Diagram
- AUDIO INPUT Section (XDP-MU100) - .................... 10
5-2. Block
Diagram
- AUDIO OUTPUT Section (XDP-MU100) - ................ 11
5-3. Block Diagram - PANEL, POWER SUPPLY Section
(XDP-MU100) - .............................................................. 12
5-4. Printed
Wiring
Board
- DSP Board (Component Side) (XDP-MU100) - .......... 14
5-5. Printed
Wiring
Board
- DSP Board (Conductor Side) (XDP-MU100) - ............ 15
5-6. Schematic
Diagram
- DSP Board (1/3) (XDP-MU100) - ................................ 16
5-7. Schematic
Diagram
- DSP Board (2/3) (XDP-MU100) - ................................ 17
5-8. Schematic
Diagram
- DSP Board (3/3) (XDP-MU100) - ................................ 18
6.
EXPLODED VIEW
................................................. 29
7.
ELECTRICAL PARTS LIST
.............................. 30
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS