STR-DN1080/ZA810ES
STR-DN1080/ZA810ES
59
59
For Schematic Diagrams.
Note:
• All capacitors are in
μ
F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in
Ω
and 1/4 W or less unless otherwise
speci
fi
ed.
•
2
: Non
fl
ammable resistor.
•
C
: Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : TUNER
• Voltages are taken with VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
:
AUDIO
f
:
TUNER
E
:
VIDEO
a
:
USB
G
: WIRELESS LAN/BLUETOOTH
N
:
MIC
For Printed Wiring Boards.
Note:
•
X
: Parts extracted from the component side.
•
Y
: Parts extracted from the conductor side.
•
f
: Internal component.
•
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Note:
The components identi-
fi
ed by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number speci
fi
ed.
Note:
Les composants identi
fi
és
par une marque
0
sont
critiques pour la sécurité.
Ne les remplacer que par
une pièce portant le nu-
méro spéci
fi
é.
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• MB-1613 board is multi-layer printed board. However, the
patterns of intermediate layers have not been included in
diagrams.
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C E
Q
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Circuit Boards Location
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
STANDBY board
NFC-ICON board
COAX board
RS232C board
GND BRACKET board
BTW board
DCDC board
WLAN/BT combo card
(WIFI1)
NFC module
(RC-S730)
(NFC1)
MAIN board
HP board
FRONTJACK board
POWERKEY board
DISPLAY board
(ZA810ES)
MB-1613 board
Note:
Among mounted electrical parts on each board, only
parts that are described in the electrical parts list can be
replaced for repairing.
The parts that are not described in the electrical parts
list cannot be replaced with single for repairing.
Note:
Among mounted electrical parts on each board, only
parts that are described in the electrical parts list can be
replaced for repairing.
The parts that are not described in the electrical parts
list cannot be replaced with single for repairing.
SYS SET
2020/11/17 21:24:35 (GMT+09:00)
