30
30
SPP-888
5-6. PRINTED WIRING BOARDS — BASE MAIN SECTION —
Note:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
p
: parts mounted on the conductor side.
•
¢
: internal component.
•
b
: Pattern from the side which enables seeing.
D1
D-13
D2
B-12
D10
A-6
D104
H-13
D105
H-13
D106
H-13
D107
H-12
D108
G-13
D109
H-12
D111
G-11
D112
G-13
D113
E-6
D115
G-13
D116
G-13
D117
G-12
D120
G-8
D201
I-3
D202
I-4
D203
E-5
D301
H-4
D302
D-5
D303
B-4
D304
B-3
D305
B-3
D701
B-14
D702
B-14
D705
E-5
D706
F-10
D709
E-9
IC1
B-9
IC101
G-11
IC102
H-3
IC103
E-8
IC201
D-5
IC301
C-5
IC302
D-3
PH101
F-11
PH102
F-11
PH201
F-10
Q1
B-12
Q2
D-12
Q3
A-8
Q4
B-12
Q101
I-11
Q102
G-11
Q103
H-9
Q104
E-11
Q105
H-11
Q106
H-10
Q111
E-10
Q120
F-6
Q121
G-7
Q201
I-4
Q202
I-5
Q701
E-10
• Semiconductor
Location
Ref. No.
Location
(Page 29)
(Page 34)