36
36
5-12. PRINTED WIRING BOARD — HAND MAIN SECTION —
D3
A-1
D101
C-4
IC1
B-6
Q1
B-9
Q101
D-2
Q102
C-3
Q103
C-2
• Semiconductor
Location
Ref. No.
Location
Note:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
r
: Through hole.
•
b
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
SPP-888
(Page 38)
(Page 38)