SEL85F14GM (FE 1.4 / 85 GM) (FE 85mm F1.4 GM)
1-1E
1. SERVICE NOTE
1-1. Chemicals
Some chemicals used for servicing are highly volatile.
Their evaporation caused by improper management affects your health and environment, and wastes resources.
Manage the chemicals carefully as follows.
• Store chemicals sealed in a specific place to prevent from exposure to high temperature or direct sunlight.
• Avoid dividing chemicals into excessive numbers of small containers to reduce natural evaporation.
• Keep containers sealed to avoid natural evaporation when chemicals are not in use.
• Avoid using chemicals as much as possible. When using chemicals, divide only required amount to a small plate from the container and
use up it.
1-2. Exterior Parts
Be careful to the following points for exterior parts used in this unit.
• Use a piece of cleaning paper or cleaning cloth for cleaning exterior parts. Avoid using chemicals.
Even if you have to use chemicals to clean heavy dirt, don
ʼ
t use paint thinner, ketone, nor alcohol.
• Insert the specific screws vertically to the part when installing a exterior part.
Be careful not to tighten screws too much.
1-3. Unleaded Solder
This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead free mark (LF) indicating the solder contains no lead.
(
Caution:
Some printed circuit boards may not come printed with the lead free mark due to their particular size.)
: LEAD FREE MARK
Be careful to the following points to solder or unsolder.
• Set the soldering iron tip temperature to 350 C approximately.
If cannot control temperature, solder/unsolder at high temperature for a short time.
Caution:
The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on
IC pins, etc.
• Be sure to control soldering iron tips used for unleaded solder and those for leaded solder so they are managed separately. Mixing un-
leaded solder and leaded solder will cause detachment phenomenon.
1-4. SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and
bridges.
2. Check the interboard wiring to ensure that no wires are
“
pinched
”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the
customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs of deterioration. Point them out to the customer and recommend their
replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
• Set the soldering iron tip temperature to 350 C approximately.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE
0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA
LISTE DES PIÈCES SONT CRITIQUES POUR L A
SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES
COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS
LES SUPPÉMENTS PUBLIÉS PAR SONY.
1-5. NOTE ON REPLACEMENT OF OPTICAL BLOCK FOR SERVICE
To replace the Optical Block For Service, connect the E-mount lens to the ILCE-5000, and release the specified Flag in the following pro-
cedure.
• Implement [Service Flag OFF (S)] of E-Mount Lens Adjustment (Adjustment Application for Service).
* A message
“
Can
ʼ
t Adjustment this model.
”
may be displayed by
“
Connect
”
for some lens models, but [Service Flag OFF (S)] can be ex-
ecuted.
Note:
The lens cannot be detected when the E-mount lens is connected to a camera without releasing the specified Flag.
Displayed as
“
F--
”
1-6. NOTE ON REPLACEMENT OF MAIN BOARD
To replace the Main Board, connect the E-mount lens to the ILCE-5000, and read/write of the adjustment data in the following procedure.
• Before main board replacement
“
Command
”
of E-Mount Lens Adjustment (Adjustment Application for Service) is set to [READ] to implement the [Adjustment Data
Backup].
• After main board replacement
“
Command
”
of E-Mount Lens Adjustment (Adjustment Application for Service) is set to [WRITE(SAVE)] to implement the [Adjustment
Data Backup].
注意
如果电池更换不当会有爆炸危险。
只能用同样类型或等效类型的电池来更换。
务必按照说明处置用完的电池。
