MZ-B10
38
38
6-4.
Printed Wiring Board – MAIN Board (Side B) –
:Uses unleaded solder.
IC801
IC802
IC501
IC601
IC701
IC901
IC301
IC302
MAIN BOARD
(SIDE B)
*
CSP(Chip Size Package)
OVER WRITE HEAD
SWITCH
&
LCD MODULE
DC IN 3V
J601
M602
(SLED)
M601
(SPINDLE)
M603
OVER WRITE
HEAD UP/DOWN
1
M
10
D R Y B A T T E R Y
S I Z E " A A "
( I E C D E S I G N A T I O N L R 6 )
2 P c s . 1 . 5 V
J303
RVDD
DTCK
KEY-R
RGND
HP-DET
REMOTE
J301
MIC
(PLUG IN POWER)
+
-
MIC901
FLAT MIC
TP1322
TP1323
(
)
1 - 6 8 7 - 7 5 3 -
11
(11)
S804
(PROTECT)
S805
HOLD
ON
OFF
SP902
(B)
S901
(A)
-
-
+
+
BLK
RED
WHT
BLU
(GND)
*
CSP(Chip Size Package)
20
1
(VREC)
(REGO1)
(VCO1)
(REGO3)
(VCOUT)
48
49
1
64
33
32
17
16
R905
R925
1
10
2
1
N
N
W
W
U
U
V
V
SL802
(OPEN/CLOSE)
1
2
A
B
C
D
E
F
G
H
I
3
4
5
6
7
8
9
10
11
12
13
• Semiconductor
Location
Ref. No.
Location
D301
D-12
D304
E-12
D305
G-12
D306
F-12
D307
C-12
D308
C-12
D309
G-12
D310
F-12
D603
B-3
D605
C-6
D608
B-2
D609
B-3
D802
B-11
D851
B-11
D852
B-11
D901
D-11
D902
C-10
D903
D-10
IC301
F-10
IC302
H-11
IC501
E-6
IC601
B-6
IC701
E-8
IC801
G-6
IC802
E-5
IC901
D-10
Q304
E-11
Q306
H-11
Q307
H-10
Q308
I-10
Q313
D-11
Q314
E-12
Q315
E-12
Q602
B-4
Q603
B-7
Q801
C-8
Q851
C-10
Q853
B-10
Q854
B-11
Q901
B-12
Q902
C-11
Summary of Contents for MZ-B10 - Minidisc Voice Recorder
Page 63: ...MZ B10 63 MEMO ...