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5

5

IT-B1

3-2. SCHEMATIC DIAGRAM — HANDSET SECTION —  • Refer to page 7 for IC Block Diagrams.

Note:
• All capacitors are in µF unless otherwise noted.  pF: µµF

50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in 

 and 

1

/

4

 

W or less unless otherwise

specified.

%

: indicates tolerance.

¢

: internal component.

C

: panel designation.

U

: B+ Line.

• Connect J2 and J3 with handset cord.

Power voltage is dc 12V and fed with regulated dc power
supply from J3 with 100 

 in series.

• Voltage is dc with respect to ground under no-signal

condition.
no mark : OFF HOOK
(

) : ON HOOK

• Voltages are taken with a VOM (Input impedance 10 M

).

Voltage variations may be noted due to normal produc-
tion tolerances.

• Signal path.

N

: RX (from TEL LINE)

O

: TX (to TEL LINE)

P

: bell

• Abbreviation

MX

: Mexican model

LA

: Latin American model

Summary of Contents for IT-B1

Page 1: ...achments included Supplied accessories Telephone line cords 2 Handset cord Design and specifications are subject to change without notice IT B1 Canadian Model Central South America Model TELEPHONE MICROFILM Notes on Chip Component Replacement Never reuse a disconnected chip component Notice that the minus side of a tantalum capacitor may be dam aged by heat Photo WHITE Type ...

Page 2: ...erance internal component C panel designation U B Line Connect J2 and J3 with handset cord Power voltage is dc 12V and fed with regulated dc power supply from J3 with 100 Ω in series Voltage is dc with respect to ground under no signal condition no mark OFF HOOK ON HOOK Voltages are taken with aVOM Input impedance 10 MΩ Voltage variations may be noted due to normal produc tion tolerances Signal pa...

Page 3: ...c power supply from J3 with 100 Ω in series Voltage is dc with respect to ground under no signal condition no mark OFF HOOK ON HOOK Voltages are taken with aVOM Input impedance 10 MΩ Voltage variations may be noted due to normal produc tion tolerances Signal path N RX from TEL LINE O TX to TEL LINE P bell Note X parts extracted from the component side internal component b Pattern from the side whi...

Page 4: ...VEE MIC MIC IR AGC 15 14 13 12 11 9 10 ROW INTERFACE CIRCUIT COLUMN INTERFACE CIRCUIT DIVIDER OSC KERNEL CONTROL CIRCUIT INPUT INTERFACE CIRCUIT OUTPUT INTERFACE CIRCUIT ROW COLUMN PROGRAMMING COUNTER D A CONVERTER DECODER DATA LATCH PULSE GENERATOR LNB MEMORY 1 C1 2 C2 3 C3 4 C4 VSS VDD 5 KT 6 OSCI 7 OSCO 8 XMUTE 9 VSS 18 R4 17 R3 16 R2 15 R1 14 MODE 12 13 TONE 10 VDD 11 HKS PO MEMORY VDD ...

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