HT-X9000F/XF9000
HT-X9000F/XF9000
41
41
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
•
X
: Parts extracted from the component side.
•
Y
: Parts extracted from the conductor side.
•
f
: Internal component.
•
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• MAIN board is multi-layer printed board. However, the
patterns of intermediate layers have not been included in
diagrams.
• Indication of transistor.
C
B
These are omitted.
E
Q
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
For Schematic Diagrams.
Note:
• All capacitors are in
μ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and 1/4 W or less unless otherwise
speci
fi
ed.
•
2
: Non
fl
ammable resistor.
•
5
: Fusible resistor.
•
C
: Panel designation.
Note:
The components identi-
fi
ed by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number speci
fi
ed.
Note:
Les composants identi
fi
és
par une marque
0
sont
critiques pour la sécurité.
Ne les remplacer que par
une pièce portant le nu-
méro spéci
fi
é.
•
A
: B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
:
AUDIO
(ANALOG)
J
:
AUDIO
(DIGITAL)
L
:
USB
E
:
Bluetooth
Note 1:
When the complete MAIN board is replaced, be sure
to refer to “SERIAL NUMBER WRITING WORK
WHEN THE MAIN BOARD REPLACED” on page
5.
Note 2:
Among mounted electrical parts on each board, only
parts that are described in the electrical parts list can
be replaced for repairing.
The parts that are not described in the electrical parts
list cannot be replaced with single for repairing.
Note 1:
When the complete MAIN board is replaced, be sure
to refer to “SERIAL NUMBER WRITING WORK
WHEN THE MAIN BOARD REPLACED” on page
5.
Note 2:
Among mounted electrical parts on each board, only
parts that are described in the electrical parts list can
be replaced for repairing.
The parts that are not described in the electrical parts
list cannot be replaced with single for repairing.
• Circuit Boards Location
MAIN board
SK1 IR REP (1) board
POWER board
SK1-TOUCH board
SK1 LED board
SK1 AMP board
SK1-JACK board
SK1-WS-CHUKEI board
Bluetooth module
(BT1)
SK1 IR REP (2) board
Summary of Contents for HT-X9000F
Page 36: ...MEMO HT X9000F XF9000 36 ...