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7-5.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
•
Circuit Boards Location
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
¢
: internal component.
•
2
: nonflammable resistor.
•
C
: panel designation.
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM/AM
E
: MD PLAY
q
: MD REC
J
: CD PLAY (ANALOG OUT)
c
: CD PLAY (DEGITAL OUT)
d
: TAPE PLAY
G
: TAPE REC
• Abbreviation
CND : Canadian model.
HK
: Hong Kong model.
SP
: Singapore model.
Note:
The components identi-
fied by mark
!
or dotted
line with mark
!
are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
!
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
®
: Through hole.
•
b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
EJECT board
MOTOR board
SENSOR board
AMP board
JOINT board
BD (CD) board
MAIN board
POWER board
SW board
BD (MD) board
HP board
PANEL board
Summary of Contents for HCD-MD1EX - System
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