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HCD-DP700
28
28
6-5.
PRINTED WIRING BOARD – MAIN SECTION – • See page 23 for Circuit Boards Location.
D51
A-11
D81
D-11
D111
H-11
D112
G-12
D113
H-12
D501
B-5
D502
B-5
D503
B-6
D504
B-5
D505
C-5
D506
C-5
D507
C-5
D508
C-5
D509
B-5
D510
F-11
D511
B-2
D950
H-9
D959
H-8
D961
H-8
D962
H-8
D971
H-11
D972
F-11
D973
F-11
D974
F-10
D975
F-10
D976
F-10
D981
C-6
D982
E-6
D983
D-7
D984
D-7
IC11
C-11
IC51
A-10
IC81
E-10
IC301
G-6
IC302
H-4
IC303
F-3
IC304
G-4
IC401
B-4
IC501
B-5
IC551
A-9
Q1
C-10
Q2
A-12
Q11
C-10
Q12
C-11
Q81
E-10
Q111
H-11
Q112
H-12
Q113
G-12
Q114
G-11
Q121
I-12
Q141
I-6
Q171
I-12
Q301
I-4
Q302
H-3
Q303
I-3
Q304
H-5
Q305
H-5
Q391
D-2
Q392
D-3
Q393
C-2
Q394
C-3
Q395
D-3
Q396
D-3
Q397
D-3
Q501
B-5
Q502
C-6
Q503
B-6
Q504
F-11
Q505
F-11
Q506
F-12
Q507
F-12
Ref. No.
Location
• Semiconductor Location
(Page 32)
(Page 27)
(Page 47)
(Page 32)
(Page 42)
(Page 45)
(Page 45)
(Page 45)
(Page 41)
(Page 49)
AEP/US/CND MODEL : (Page 36)
E51/MX MODEL : (Page 38)
AEP/US/CND MODEL : (Page 36)
E51/MX MODEL : (Page 38)
PB LEVEL (L)
(A)
REC LEVEL
(R) (A)
REC LEVEL
(L) (A)
REC LEVEL
(R) (B)
REC LEVEL
(L) (B)
PB
LEVEL
(L) (B)