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HCD-CPZ1DAB
36
36
HCD-CPZ1DAB
D701
B-8
D702
B-8
D703
A-8
D704
A-8
D705
D-8
D706
D-8
D713
E-5
D755
D-10
D756
D-10
IC701
B-4
IC703
B-3
IC704
B-10
IC705
C-3
IC707
D-4
IC708
D-2
IC709
C-2
Q701
F-1
Q702
G-5
Q703
G-5
Q752
G-2
Q753
G-2
•
Semiconductor
Location
Ref. No. Location
7-17. PRINTED WIRING BOARD – AMP Board –
:Uses unleaded solder.
•
See page 23 for Circuit Boards Location.
C840
C841
C842
C843
C813
C847
C773
C774
R721
R775
C772
C712
C781
D703
D704
C768
C782
D756
C718
D755
C763
C830
C775
C827
R739
R768
C756
C828
R772
C749
C796
L701
D702
D701
C732
R743
R744
C738
C739
C737
L702
R740
C792
L705
IC704
C797
R750
C785
R742
C831
C832
C786
L704
C761
C783
C806
C745
C845
C846
C723
C724
R774
R725
C722
C709
C759
C706
R724
D706
D705
C713
C829
C725
C839
R771
R718
C762
C849
C848
C752
R773
C741
C744
C844
L703
CN700
EP701
EP702
L711
L760
L758
L759
C777
C769
CN704
C770
C711
C791
C751
C731
L761
C748
C735
C740
C747
C798
EP703
L710
L708
L709
C728
C719
C753
C720
C702
C701
EP705
EP706
CN705
CN702
CN703
IC705
X701
X702
IC709
R778
R777
R776
R726
R727
R728
C778
Q753
C703
R717
R709
R762
R761
R764
Q702
R756
R754
R752
R758
R800
R757
R759
C757
R701
R770
R769
IC703
C764
C715
C767
C750
C758
C754
R723
C729
R729
R730
C733
R765
C730
R745
R784
R785
R786
R787
R788
R741
R790
R746
R747
R731
R733
R734
R736
R737
C734
R751
R748
R749
C746
R779
C704
C799
C780
R789
R783
R782
R781
C765
C726
C784
C779
C787
C788
R712
R711
R714
C710
R708
R713
C708
R707
D713
R716
R720
R719
C716
C714
C717
IC708
R801
Q752
R792
R793
C794
Q701
C766
R738
IC707
Q703
R704
R706
IC701
AMP BOARD
(CONDUCTOR SIDE)
1-865-283-
12
(12)
(CHASSIS)
(CHASSIS)
(CHASSIS)
(CHASSIS)
(CHASSIS)
1
3
4
5
1
12
36
37
48
24
13
25
E
E
E
E
E
AMP BOARD
(COMPONENT SIDE)
1-865-283-
12
(12)
5
4
1
2
1
1
5
2
1
2
A
B
C
D
E
F
G
H
1
2
3
4
5
6
7
8
9
10
11
FFC302
Summary of Contents for HCD-CPZ1DAB
Page 82: ...82 HCD CPZ1DAB MEMO ...