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HCD-CPZ1DAB
26
26
HCD-CPZ1DAB
7-6. PRINTED WIRING BOARD – TC Board –
:Uses unleaded solder.
•
See page 23 for Circuit Boards Location.
D641
E-4
D681
F-5
IC601
C-3
Q601
C-3
Q602
B-3
Q638
E-5
Q640
E-4
Q642
B-6
Q643
C-6
Q651
C-3
Q652
B-3
Q680
C-4
Q681
C-4
Q688
C-4
Q691
F-3
Q692
F-4
Q693
F-5
Q694
F-4
•
Semiconductor
Location
Ref. No. Location
C615
C665
C664
Q638
R625
R663
R617
R607
R631
R622
C631
R682
R683
R659
R660
IC601
R611
R644
R684
Q681
R661
R647
R635
R643
R645
R612
R610
R602
R616
R653
R685
R687
R688
C617
R689
C660
R681
R603
R690
R691
R692
R693
R694
R695
C681
R651
D681
Q692
R652
R655
R606
Q691
C610
C612
C662
C613
R640
R662
R658
Q680
R633
R632
Q640
C657
R656
C661
R608
R646
Q688
R609
R657
R605
R601
C663
C614
C606
R624
C645
R630
R648
C611
C607
R614
R613
C656
R623
Q601
Q602
Q651
Q652
C653
R664
C667
C643
C644
D641
NO601
C603
JW601
JW617
CN603
JW633
JW604
C633
JW642
L601
JW607
C646
L651
JW639
JW615
JW608
Q643
Q693
Q694
JW638
JW600
JW634
JW637
C601
JW640
C642
JW635
C634
JW625
JW614
JW632
JW602
JW626
JW613
T601
Q642
JW636
C632
C608
C658
JW624
JW623
JW610
JW612
JW628
C635
C641
C651
JW611
JW618
JW631
CN602
E
E
E
E
E
E
E
E
E
E
E
E
E
1
8
A
K
A
K
30
31
11
20
21
1
40
10
TC BOARD
1-870-852-
12
(12)
BIAS
OSC
E
E
ERASE
L-CH
R-CH
HRPE601
(REC/PLAY/ERASE)
1
8
TAPE MECHANISM
DECK BLOCK
SUPPLIED WITH THE
ASSEMBLED BLOCK
A
B
C
D
E
F
G
1
2
3
4
5
6
7
FFC301
FFC601
Summary of Contents for HCD-CPZ1DAB
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