Sony HCD-CPZ1DAB, Service Manual, Page: 2 / 90

2
HCD-CPZ1DAB
TABLE OF CONTENTS
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
1. SERVICING NOTES
............................................... 4
2. GENERAL
................................................................... 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Case ................................................................................. 7
3-3. Front Panel Section ......................................................... 7
3-4. TC Board, Mechanical Deck (CMAL1Z255A) .............. 8
3-5. PANEL Board .................................................................. 8
3-6. MAIN Board .................................................................... 9
3-7. CD Mechanism Deck (CDM80BH-K6BD83S-WD) ...... 9
3-8. DAB Module Assy .......................................................... 10
3-9. Chassis (Top) ................................................................... 10
3-10. Lever (Loading-L/R) ....................................................... 11
3-11. Lever (Disc Sensor), Lever (Disc Stop) .......................... 12
3-12. DRIVER Board,
Motor (Pulley) Assy (Loading) (M701) .......................... 12
3-13. CD Board ......................................................................... 13
3-14. BU Section ...................................................................... 13
3-15. Optical Pick-up Block (KSM-213DCP) .......................... 14
3-16. Lever (BU Lock) ............................................................. 14
3-17. Close Lever ...................................................................... 15
3-18. Lever (DIR), Gear (IDL-B) ............................................. 15
3-19. Gear (IDL-C) ................................................................... 16
4. TEST MODE
.............................................................. 17
5. MECHANICAL ADJUSTMENTS
....................... 19
6. ELECTRICAL ADJUSTMENTS
......................... 19
7. DIAGRAMS
7-1. Block Diagram
– CD SERVO/TAPE DECK Section – ............................ 20
7-2. Block Diagram – MAIN Section – .................................. 21
7-3. Block Diagram
– PANEL/KEY/POWER SUPPLY Section – .................. 22
7-4. Printed Wiring Board – CD Board – ............................... 24
7-5. Schematic Diagram – CD Board – .................................. 25
7-6. Printed Wiring Board – TC Board – ................................ 26
7-7. Schematic Diagram – TC Board – .................................. 27
7-8. Printed Wiring Board – DAB Board – ............................. 28
7-9. Schematic Diagram – DAB Board – ............................... 29
7-10. Printed Wiring Board – DRIVER Board – ...................... 30
7-11. Schematic Diagram – DRIVER Board – ......................... 30
7-12. Printed Wiring Board – MAIN Board – .......................... 31
7-13. Schematic Diagram – MAIN Board (1/2) – .................... 32
7-14. Schematic Diagram – MAIN Board (2/2) – .................... 33
7-15. Schematic Diagram – AMP Board (1/2) – ...................... 34
7-16. Schematic Diagram – AMP Board (2/2) – ...................... 35
7-17. Printed Wiring Board – AMP Board – ............................ 36
7-18. Printed Wiring Board – SP Board – ................................ 37
7-19. Schematic Diagram – SP Board – ................................... 37
7-20. Printed Wiring Board – LCD Board – ............................. 38
7-21. Schematic Diagram – LCD Board – ................................ 39
7-22. Printed Wiring Boards – PANEL Section – ..................... 40
7-23. Schematic Diagram – PANEL Section – ......................... 41
7-24. Printed Wiring Boards – JACK Section – ....................... 42
7-25. Schematic Diagram – JACK Section – ............................ 43
7-26. Printed Wiring Board – SW POWER Board – ................ 44
7-27. Schematic Diagram – SW POWER Board – ................... 45
7-28. Printed Wiring Board – SUB POWER Board – .............. 46
7-29. Schematic Diagram – SUB POWER Board – ................. 47
8. EXPLODED VIEWS
8-1. Case Section .................................................................... 60
8-2. Mechanical Deck (Tape) Section ..................................... 61
8-3. Front Panel Section ......................................................... 62
8-4. Lid (TC) Section .............................................................. 63
8-5. Chassis Section ................................................................ 64
8-6. AMP/Power Section ........................................................ 65
8-7. CD Mechanism Deck Section-1
(CDM80BH-K6BD83S-WD) .......................................... 66
8-8. CD Mechanism Deck Section-2
(CDM80BH-K6BD83S-WD) .......................................... 67
8-9. CD Mechanism Deck Section-3
(CDM80BH-K6BD83S-WD) .......................................... 68
8-10. Base Unit Section (BU-K6BD83S-WD) ......................... 69
9. ELECTRICAL PARTS LIST
................................ 70