– 17 –
ICX423AL
Sony Corporation
P
a
c
k
a
g
e Outline
Unit:
mm
P
A
CKA
GE MA
TERIAL
LEAD TREA
TMENT
LEAD MA
TERIAL
P
A
CKA
GE MASS
DRA
WING NUMBER
Cer
amic
GOLD PLA
TING
5.90g
42 ALLO
Y
AS-A11(E)
P
A
CKA
GE STR
UCTURE
M
0.3
0.25
0.35
13.15
5.0
R3.0
6.0
2.54
1.27
0.46
5.5 ± 0.2
26.0 ± 0.25
3.2 ± 0.3
20.32
20.2 ± 0.3
0.5
1.0
2-
2-
D
A
(AT STAND OFF)
11
20
1
10
31.0 ± 0.4
27.0 ± 0.3
2-
φ
2.50
+ 0.25
– 0
φ
2.00
+ 0.15
– 0
(Reference Hole)
1Pin Index
(Elongated Hole)
2.00
+ 0.15
– 0
×
2.5
C
B
0˚ to 9˚
~
~
20 pin DIP (800mil)
1.
"A
" is the center of the effective image area.
2
.
The str
aight line
“B”
which passes through the center of the ref
erence hole and the elongated
hole is the ref
erence axis of v
e
rtical direction (V).
3
.
The str
aight line
“C”
which passes through the center of the ref
erence hole at r
ight angle to v
e
rtical
ref
erence line
“B”
is the ref
erence axis of hor
iz
ontal direction (H).
4
.
The bottom
“D”
is the height ref
erence
.(T
w
o
points are specified.)
5.
The center of the eff
ectiv
e image area specified relativ
e to the ref
erence hole
is (H,
V) = (13.15, 5.0) ± 0.15mm.
6
.
The angle of rotation relativ
e to the ref
erence line
“B”
is less than ± 1˚
7
.
The height from the bottom
“D”
to the eff
ectiv
e image area is 1.46 ± 0.15mm.
8
.
The tilt of the eff
ectiv
e image area relativ
e to the bottom
“D”
is less than 60µm.
9
.
The thic
kness of the co
v
er glass is 0.75mm and the refr
activ
e inde
x is 1.5.
