HCD-G1BiP/G1iP
HCD-G1BiP/G1iP
27
27
For Schematic Diagrams.
Note:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
•
All resistors are in
Ω
and 1/4 W or less unless otherwise
specifi
ed.
•
f
: Internal component.
•
2
: Nonfl
ammable resistor
.
•
C
: Panel designation.
THIS NOTE IS COMMON FOR PRINTED
WIRING BOARDS
AND SCHEMA
TIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•
A
: B+ Line.
•
B
: B– Line.
•
V
oltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
– BD94D Board –
no mark
: CD PLA
Y
– Other Boards –
no mark
: TUNER
FM
( )
: TUNER
DAB
*
: Impossible to measure
•
V
oltages are taken with VOM (Input impedance 10 M
:
).
V
oltage variations may be noted due to normal production
tolerances.
•
W
aveforms are taken with a oscilloscope.
V
oltage variations may be noted due to normal production
tolerances.
•
Circled numbers refer to waveforms.
• Signal
path.
F
:
TUNER
J
: CD PLA
Y
d
:
USB
f
:
AUDIO
IN
L
:
DAB
• Abbreviation
CH
: Chinese model
•
The voltage and waveform of CSP
(chip size package)
cannot be measured, because its lead layout is dif
ferent
from that of conventional IC.
For Printed W
iring Boards.
Note:
•
X
: Parts extracted from the component side.
•
Y
: Parts extracted from the conductor side.
•
f
: Internal component.
•
: Pattern from the side which enables seeing.
(The other layers’
patterns are not indicated.)
•
Indication of transistor
.
C
B
These are omitted.
E
Q
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
•
Circuit Boards Location.
• Abbreviation
CH
: Chinese model
Note:
The components identifi
ed by mark
0
or
dotted line with mark
0
are critical for safety
.
Replace only with part number specifi
ed.
•
MAIN board is multi-layer printed board. However
, the
patterns of intermediate-layers have not been included in
this diagrams.
• Lead
layouts
surface
CSP
(Chip Size Package)
Lead layout of conventional IC
DAB board
(G1BiP)
TUNER board
BD94D board
MAIN board
AMP
board
DCDC board
MOT
OR board
JOG1 board
FL
board
SUB-PT board
module (DAB tuner) (DAB1)
(G1BiP)
JOG2 board
USB board
HP
board
