CDX-G1200U/G1201U/G1202U/G1280UM
2
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those speci
fi
ed herein may result in hazardous radia-
tion exposure.
1.
SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 7
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 13
3-2. Mini Fuse (Blade Type) (FU1), Cover ............................ 13
3-3. Sub
Panel
Assy
................................................................ 14
3-4. CD Mechanism Deck (MG-101CF-188) ........................ 14
3-5. MAIN
Board
................................................................... 15
3-6. Service
Position
.............................................................. 15
4. DIAGRAMS
4-1. Block Diagram - MAIN Section - ................................... 16
4-2. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 17
4-3. Printed Wiring Boards - MAIN Section (1/2) - .............. 18
4-4. Printed Wiring Boards - MAIN Section (2/2) - .............. 19
4-5. Schematic Diagram - MAIN Section (1/4) - ................... 20
4-6. Schematic Diagram - MAIN Section (2/4) - ................... 21
4-7. Schematic Diagram - MAIN Section (3/4) - ................... 22
4-8. Schematic Diagram - MAIN Section (4/4) - ................... 23
5.
EXPLODED VIEWS
5-1. Sub Panel Section ........................................................... 31
5-2. Chassis
Section
............................................................... 32
6.
ELECTRICAL PARTS LIST
.............................. 33
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
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SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
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This product is protected by certain
intellectual property rights of Microsoft
Corporation. Use or distribution of such
technology outside of this product is
prohibited without a license from Microsoft
or an authorized Microsoft subsidiary.
MPE
G
Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
Thomson.
Android is a trademark of
G
oogle Inc.
libFLAC
Copyright (C) 2000-2009 Josh Coalson
Copyright (C) 2011-2013 Xiph.Org Foundation
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– Redistributions in binary form must
reproduce the above copyright notice, this
list of conditions and the following
disclaimer in the documentation and/or
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Copyrights
• US and CND models:
• EA model:
This product is classified as a Class 1 Laser
product under IEC 60825-1:2007.
This label is located on bottom surface of
the product.
