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Si5351A/B/C
Preliminary Rev. 0.95
67
14. Package Outline (24-Pin QSOP)
Table 14. 24-QSOP Package Dimensions
Dimension
Min
Nom
Max
A
—
—
1.75
A1
0.10
—
0.25
b
0.19
—
0.30
c
0.15
—
0.25
D
8.55
8.65
8.75
E
6.00 BSC
E1
3.81
3.90
3.99
e
0.635 BSC
L
0.40
—
1.27
L2
0.25 BSC
q
0
—
8
aaa
0.10
bbb
0.17
ccc
0.10
Notes:
1.
All dimensions shown are in millimeters (mm) unless otherwise noted.
2.
Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3.
This drawing conforms to the JEDEC Solid State Outline MO-137, Variation C
4.
Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.