Silicon Graphics 1400, Maintenance And Upgrade Manual

Page: 55 / 162

Processors
41
Reduce the risk of electrostatic discharge (ESD) damage to the processor by doing the
following:
• Touch the metal chassis before touching the processor or baseboard.
• Keep part of your body in contact with the metal chassis to dissipate the static
charge while handling the processor.
• Avoid moving around unnecessarily.
Removing a Processor
1. Observe the safety and ESD precautions at the beginning of Chapter 1 and the
additional cautions given here.
2. Remove the access cover and the rear foam cover over the electronics bay.
3. As you work, place processors on a grounded, static-free surface or conductive
foam pad.
4. With your right thumb on the face of the retention module bracket, wrap your right
index finger around the tab protruding from the right edge of the bracket. See
Figure 2-4 for an example.
5. Use your index finger to slightly pull the tab outward and to the left. You should not
try to pull the entire bracket; rather, the back of the tab has a latch that releases
when the TAB is pulled slightly.
6. When you have released the right edge of the bracket, rotate it 90
°
to the left until it
is perpendicular to the front of the retention module. The left edge of the bracket
has an open hinge that can release from the module when you rotate the bracket to
the left.
7. Disengage the open hinge by moving (not rotating) the entire bracket to the right.
Remove the bracket and set it aside.
8. Pull the two tabs attached to the S.E.C. cartridge (see Figure 2-5) straight away from
the baseboard. As you do, the cartridge disengages from its connector on the
baseboard.
9. Slide the S.E.C. cartridge straight away from the baseboard, out of the retention
module. Put it on a piece of conductive foam and store it in an antistatic package.