Siemens Simatic IPC647C, Operating Instructions Manual

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Table of contents
SIMATIC IPC647C
Operating Instructions, 12/2010, A5E02669337-02
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11.2.1 General installation procedure...................................................................................................109
11.2.2 Restoring the Factory State of the Software Using the Restore DVD .......................................110
11.2.3 Installing Windows .....................................................................................................................111
11.2.3.1 Setting up partitions for Windows XP and Server 2008 operating systems ..............................112
11.2.4 Setting up the language selection by means of the Multilanguage User Interface (MUI)..........113
11.2.5 Recovery from Windows 7 and Windows Server 2008 .............................................................113
11.2.6 Installing drivers and software ...................................................................................................117
11.2.7 Installing the RAID Controller software......................................................................................117
11.2.8 Installing the burner software.....................................................................................................118
11.2.9 Installing updates .......................................................................................................................118
11.2.9.1 Updating the operating system ..................................................................................................118
11.2.9.2 Installing or updating application programs and drivers ............................................................118
11.2.10 Data backup / subsequent modification of partitions .................................................................119
11.2.10.1 Hardware supported .............................................................................................................119
11.2.10.2 Creating an image.................................................................................................................119
11.2.10.3 Modifying the partitions.........................................................................................................119
11.2.11 CP 1616 onboard.......................................................................................................................119
11.3
BIOS update...............................................................................................................................120
11.4 BIOS Recovery ..........................................................................................................................121
12 Alarm, error, and system messages ...................................................................................................... 123
12.1
BIOS beep codes.......................................................................................................................123
12.2 Boot error messages..................................................................................................................129
13 Troubleshooting/FAQs........................................................................................................................... 131
13.1
General problems ......................................................................................................................131
13.2 Problems when Using Modules of Third-party Manufacturers...................................................134
14 Technical specifications......................................................................................................................... 135
14.1
General specifications................................................................................................................135
14.2 Power requirements of components (maximum values) ...........................................................140
14.3 Power supply (AC) .....................................................................................................................141
14.4 Technical data of the telescopic rails.........................................................................................142
15 Dimension drawings .............................................................................................................................. 143
15.1
Dimensional drawing of the device ............................................................................................143
15.2 Dimensional drawings for installation of expansion modules ....................................................145
15.3 Dimensional drawing for the use of telescopic rails...................................................................145
16 Detailed descriptions ............................................................................................................................. 147
16.1
Motherboard...............................................................................................................................147
16.1.1 Structure and functions of the motherboard ..............................................................................147
16.1.2 Technical features of the motherboard ......................................................................................148
16.1.3 Position of the interfaces on the motherboard...........................................................................150
16.1.4 External interfaces .....................................................................................................................151
16.1.5 Internal ports ..............................................................................................................................160
16.2
Bus boards.................................................................................................................................167
16.2.1 Bus board models ......................................................................................................................167
16.2.2 Exclusive PCI hardware interrupt...............................................................................................169