Section 5: Maintenance
Repairs
2018 Insta-Berm (Frame) Operations Manual
(Version D)
27
We Engineer Solutions
Repairing in High Humidity
In conditions of high humidity, a proper technique is essential for securing the bond strength desired as the
presence of surface moisture can destroy the effectiveness of the cemented bond.
The evaporation of solvent from the adhesive may reduce the surface temperature below the dew point
resulting in condensation of water vapour on the surface of the adhesive. This is often visible as fogging or
a milky white appearance on the surface.
The use of a solvent to clean the surface prior to cementing can also reduce temperatures below the dew
point.
To overcome the high humidity problem, raise the temperature of the patch area. This can be accomplished
with a warm air fan.
Applying the Glue
Small scrapes, damaged fabric coating or pinholes, which are not leaking, can be repaired with glue only.
They do not require a patch. (A small scrape is defined as damage to the outer fabric coating only. A pinhole
is defined as a small puncture that is not leaking.) However, damage to the base fabric must be repaired with
a patch.
Warning
Glue vapours are highly explosive. Explosive vapours may occur causing fire and/or injury. Keep
away from all sparks, flame, lighters or cigarettes.
Solvent and glue are both extremely hazardous. Use solvent and glue under well ventilated
conditions only.
When using a warm air fan, either use one which is rated EXPLOSION PROOF or make sure that
there is a steady flow of air past the work area to remove fumes as they are generated.
