C
HEETAH
15K.7 FC P
RODUCT
M
ANUAL
, R
EV
. E
38
10.4
D
RIVE MOUNTING
Mount the drive using the bottom or side mounting holes. If you mount the drive using the bottom holes, ensure that you do
not physically distort the drive by attempting to mount it on a stiff, non-flat surface.
The allowable mounting surface stiffness is 80 lb/in (14.0 N/mm). The following equation and paragraph define the allowable
mounting surface stiffness:
where K is the mounting surface stiffness (units in lb/in or N/mm) and X is the out-of-plane surface distortion (units in inches
or millimeters). The out-of-plane distortion (X) is determined by defining a plane with three of the four mounting points fixed
and evaluating the out-of-plane deflection of the fourth mounting point when a known force (F) is applied to the fourth point.
Note.
Before mounting the drive in any kind of 3.5-inch to 5.25-inch adapter frame, verify with Seagate Technology that
the drive can meet the shock and vibration specifications given herein while mounted in such an adapter frame.
Adapter frames that are available may not have a mechanical structure capable of mounting the drive so that it
can meet the shock and vibration specifications listed in this manual.
10.5
G
ROUNDING
Signal ground (PCBA) and HDA ground are connected together in the drive and cannot be separated by the user. The
equipment in which the drive is mounted is connected directly to the HDA and PCBA with no electrically isolating shock
mounts. If it is desired for the system chassis to not be connected to the HDA/PCBA ground, the systems integrator or user
must provide a nonconductive (electrically isolating) method of mounting the drive in the host equipment.
Increased radiated emissions may result if you do not provide the maximum surface area ground connection between
system ground and drive ground. This is the system designer’s and integrator’s responsibility.
K x X = F < 15lb = 67N
