2. Select the appropriate steel mesh according to chip type. Fix the steel
mesh to the ceiling cover and tighten it with 4 M3 screws, covered with
lid. Adjust 4 Jimmy on the base to meet the suitable height required.
3. Observe the hole on steel mesh which should be completely coincide
with the solder holes on BGA. If not coincide, we must remove the cap
to reposition to ensure steel mesh holes aligned with the chip, and then
lock the four screws.
4. Locking two no spring fixed slide, remove the BGA chip and coated
with a thin layer of solder flux, card the chip into the base again,
covered with lid (make sure the right direction).
5. Put into solder ball, clench hands and gently swaying reballing station
to ensure the solder ball completely filled in the holes and pour out
extra solder balls.
6. Place the reballing station on the flat location; remove the lid, carefully
scored BGA chips. Observe the chip, if individual solder balls are not in
the rightly, please correct it with forceps.
7. It is convenient to use our different types of repair stations or welding
machine to fix solder ball. Heat solder balls on the BGA to soldering it
on BGA, thus reballing finished.
