Sanyo PLC-XE32, Service Manual

Page: 96 / 96

A12
Diagrams & Drawings (LE7-XE3200)
Do not use solder containing lead.
This product has been manufactured using lead-free solder
in order to help preserve the environment.
Because of this, be sure to use lead-free solder when
carrying out repair work, and never use solder containing
lead.
Lead-free solder has a melting point that is 30–40 °C (86–
104 °F) higher than solder containing lead, and moreover
it does not contain lead which attaches easily to other
metals. As a result, it does not melt as easily as solder
containing lead, and soldering will be more difficult even if
the temperature of the soldering iron is increased.
The extra difficulty in soldering means that soldering time
will increase and damage to the components or the circuit
board may easily occur.
Because of this, you should use a soldering iron and solder
that satisfy the following conditions when carrying out
repair work. Also, soldering work must be done in a short
time.
Soldering iron
Use a soldering iron which is 70 W or equivalent, and
which lets you adjust the tip temperature up to 450 °C
(842 °F) It should also have as good temperature recovery
characteristics as possible.
Solder
Use solder with the metal content and composition ratio
by weight given in the table below. Do not use solders
which do not meet these conditions.
Metal content Tin (Sn) Silver (Ag) Copper (Cu)
Composition
ratio by weight
96.5 % 3.0 % 0.5 %
Note:
If replacing existing solder containing lead with lead-free
solder in the soldered parts of products that have been
manufactured up until now, remove all of the existing
solder at those parts before applying the lead-free solder.
Note on Soldering