COMe-bTL6 - User Guide. Rev. 1.5
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2.3.6.
Chipset (PCH)
The COMe-bTL6 supports the Series 500 mobile chipset (Intel® Mobile HM570E, Intel® Mobile QM580E and Intel®
Mobile RM590E). The chipset provides I/O support.
Table 7: Chipset (PCH)
I/O
USB 3.1 Gen 2/USB 2.0, PCIe Gen 3, SATA 3.0, Integrated LAN, 2.5 GbE TSN MAC
[1]
Interfaces
SPI, eSPI, SMBus, HD Audio
[1]
Option for processor variants Intel® Xeon® with RM590E PCH only, see Chapter 2.3.14: Ethernet LAN
2.3.7.
System Memory
The COMe-bTL6 supports up to 64 GByte of SODIMM DDR4-3200 non-ECC/ECC memory or up to 96 GByte using a
third SODIMM socket implemented in the bottom side of the module.
Table 8: System Memory
Socket
SODIMM DDR4-3200
Memory Type
DDR4-3200 1.2 V non-ECC/ECC
Channels
Dual-channel
Max Memory Module Size
Up to 64 GByte (2x 32 GByte)
Up to 96 GByte (3x 32 GByte )
Memory Speed
3200 MTs (max.)
The two SODIMM memory sockets are located on the top side of the module where socket one is 4 mm height and
socket two is 8 mm high. Each socket may be populated with a DDR4 SODIMM module mounted horizontally.
There is an option for a third SODIMM memory socket mounted horizontally on the bottom side of the module. Note:
this increase in memory, decreases performance due to the asymmetric memory layout.
In general, memory modules have a much lower longevity than embedded motherboards, and therefore the EOL of
the memory modules may occur several times during the lifetime of the motherboard. Kontron guarantees to
maintain memory modules by replacing EOL memory modules with another qualified similar module.
As a minimum, it is recommended to use Kontron memory modules for prototype system(s) in order to prove the
stability of the system and as a reference.
For volume production, if required, test and qualify other types of RAM. In order to qualify RAM it is recommend to
configure three systems running a RAM Stress Test program in a heat chamber at 60°C, for a minimum of 24 hours.
For a list of Kontron memory modules, see Table 4: Accessories
2.3.8.
Graphics Interfaces
The COMe-bTL6 implements the processor graphics based the on Xe graphics core Architecture with substantial
gains in performance and lower-power consumption over prior graphics generations. The Xe architecture supports
up to 96 Execution Units (EUs) depending on the processor variant.
The modules supports up to four simultaneous displays 4K at 60 Hz or a single display 8k @ 60 Hz by joining two
pipes over a single port.