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1 Precautions
1-2
1-2-1 General Servicing
Precautions
1.
Always unplug the unit’s AC power cord from the AC
power source and disconnect the DC Power Jack before
attempting to:
(a) remove or reinstall any component or assembly, (b)
disconnect PCB plugs or connectors, (c) connect a test
component in parallel with an electrolytic capacitor.
2.
Some components are raised above the printed circuit
board for safety. An insulation tube or tape is sometimes
used. The internal wiring is sometimes clamped to
prevent contact with thermally hot components. Reinstall
all such elements to their original position.
3. After servicing, always check that the screws,
components and wiring have been correctly reinstalled.
Make sure that the area around the serviced part has not
been damaged.
1.
Immediately before handling any semiconductor
components or assemblies, drain the electrostatic charge
from your body by touching a known earth ground.
Alternatively, wear a discharging wrist-strap device. To
avoid a shock hazard, be sure to remove the wrist strap
before applying power to the monitor.
2.
After removing an ESD-equipped assembly, place it on a
conductive surface such as aluminum foil to prevent
accumulation of an electrostatic charge.
3.
Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ESDs.
4.
Use only a grounded-tip soldering iron to solder or
desolder ESDs.
5.
Use only an anti-static solder removal device. Some
solder removal devices not classified as “anti-static” can
generate electrical charges sufficient to damage ESDs.
4.
Check the insulation between the blades of the AC plug
and accessible conductive parts (examples: metal panels,
input terminals and earphone jacks).
5.
Insulation Checking Procedure: Disconnect the power
cord from the AC source and turn the power switch ON.
Connect an insulation resistance meter (500 V) to the
blades of the AC plug.
The insulation resistance between each blade of the AC
plug and accessible conductive parts (see above) should
be greater than 1 megohm.
6.
Always connect a test instrument’s ground lead to the
instrument chassis ground before connecting the positive
lead; always remove the instrument’s ground lead last.
6.
Do not remove a replacement ESD from its protective
package until you are ready to install it. Most
replacement ESDs are packaged with leads that are
electrically shorted together by conductive foam,
aluminum foil or other conductive materials.
7.
Immediately before removing the protective material
from the leads of a replacement ESD, touch the
protective material to the chassis or circuit assembly into
which the device will be installed.
Caution:
Be sure no power is applied to the
chassis or circuit and observe all
other safety precautions.
8.
Minimize body motions when handling unpackaged
replacement ESDs. Motions such as brushing clothes
together, or lifting your foot from a carpeted floor can
generate enough static electricity to damage an ESD.
1-3 Static Electricity Precautions
Some semiconductor (solid state) devices can be easily damaged by static electricity. Such components are commonly called
Electrostatically Sensitive Devices (ESD). Examples of typical ESD are integrated circuits and some field-effect transistors. The
following techniques will reduce the incidence of component damage caused by static electricity.
1-2 Servicing Precautions
WARNING:
An electrolytic capacitor installed with the wrong polarity might explode.
Caution:
Before servicing units covered by this service manual, read and follow the Safety Precautions section
of this manual.
Note:
If unforeseen circumstances create conflict between the following servicing precautions and any of the safety
precautions, always follow the safety precautions.
Summary of Contents for SyncMaster 400TXn
Page 9: ...Memo 1 Precautions 1 4...
Page 25: ...3 Alignment and Adjustments 3 10 5 Yes Click 6 OK Click...
Page 41: ...3 Alignment and Adjustments 3 26 Memo...
Page 43: ...4 Troubleshooting 4 2 WAVEFORMS 1 2 4 3 CN602 C653 C622 C603...
Page 45: ...4 Troubleshooting 4 4 5 5 5 5 WAVEFORMS IC101 is on the rear board of IC103...
Page 47: ...4 Troubleshooting 4 6 7 8 WAVEFORMS IC101 is on the rear board of IC103...
Page 49: ...4 Troubleshooting 4 8 5 6 WAVEFORMS 9 10...
Page 70: ...14 1 1 7 7 46 46 46 0 10 5 3 7 46 7 7 7...
Page 71: ...14 2 7 3 7 7 3 7 7 7 0 7 4 7 0 4 7 4 4 7 4 7 3 3 7 6 0 3 4063 4...
Page 72: ...14 3 7 0 10 5 6 0 6 0 3 7 0 10 5 13 1 4063 7...
Page 73: ...14 4 7 7 6 0 3 7 7 0 4063...
Page 74: ...14 5 7 0 10 5 6 0 6 0 3 0 10 5 13 1 13 1 4063...
Page 75: ...14 6 69 3 0 503 065 6 0 3...
Page 77: ...14 8 7 45 1C 1S 7 45...
Page 80: ...14 11 57 5 57 4 4 4 57...
Page 92: ...8 1 8 Wiring Diagram 8 Wiring Diagram 8 1 Main Board Wiring Diagram...
Page 93: ...8 Wiring Diagram 8 2 8 2 Network Board Wiring Diagram...
Page 98: ...9 5 9 4DIFNBUJD JBHSBN 9 5 IP board Schematics Diagram 1...
Page 99: ...9 4DIFNBUJD JBHSBN 9 6 9 6 IP board Schematics Diagram 2...
Page 100: ...9 7 9 4DIFNBUJD JBHSBN 9 7 IP board Schematics Diagram 2...
Page 101: ...9 4DIFNBUJD JBHSBN 9 8 9 8 Sub power Schematics Diagram...
Page 103: ...9 Schematic Diagram 9 10...
Page 112: ...9 Schematic Diagram 9 19...
Page 113: ...9 Schematic Diagram 9 20...
Page 114: ...9 Schematic Diagram 9 21...
Page 115: ...9 Schematic Diagram 9 22...
Page 116: ...9 Schematic Diagram 9 23...
Page 117: ...9 Schematic Diagram 9 24...
Page 118: ...9 Schematic Diagram 9 25...
Page 119: ...9 Schematic Diagram 9 26...
Page 120: ...9 Schematic Diagram 9 27...
Page 121: ...9 Schematic Diagram 9 28...
Page 122: ...9 Schematic Diagram 9 29...
Page 123: ...9 Schematic Diagram 9 30...
Page 124: ...9 Schematic Diagram 9 31...
Page 125: ...9 Schematic Diagram 9 32...
Page 126: ...9 Schematic Diagram 9 33...
Page 127: ...Memo 9 Schematic Diagram 9 34...
Page 143: ...12 PCB layout 12 2 12 2 Network PCB layout LAN USB...
Page 144: ...12 PCB layout 12 3 12 3 IP board layout...
Page 145: ...12 PCB layout 12 4 12 4 Network Power board layout...
Page 151: ...JSDVJU FTDSJQUJPOT 13 6 Memo...
Page 171: ...14 Reference Infomation 14 20 Memo...