
6. Material List
- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -
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6-76
Main System
Location
SEC CODE
NAME
Description
Qt'y
SA/SNA
EC13
2409-001159 C-ORGANIC,SMD
220uF,20%,2.5V,-,Tape and Reel,3.5*2.8*1.9,-
1
SNA
EC14
2409-001159 C-ORGANIC,SMD
220uF,20%,2.5V,-,Tape and Reel,3.5*2.8*1.9,-
1
SNA
EC18
2409-001159 C-ORGANIC,SMD
220uF,20%,2.5V,-,Tape and Reel,3.5*2.8*1.9,-
1
SNA
EC19
2409-001159 C-ORGANIC,SMD
220uF,20%,2.5V,-,Tape and Reel,3.5*2.8*1.9,-
1
SNA
EC20
2409-001159 C-ORGANIC,SMD
220uF,20%,2.5V,-,Tape and Reel,3.5*2.8*1.9,-
1
SNA
EC21
2409-001159 C-ORGANIC,SMD
220uF,20%,2.5V,-,Tape and Reel,3.5*2.8*1.9,-
1
SNA
EC15
2402-001042 C-AL,SMD
100uF,20%,16V,GP,TP,6.6x6.6x5.4mm
1
SNA
EC16
2402-001042 C-AL,SMD
100uF,20%,16V,GP,TP,6.6x6.6x5.4mm
1
SNA
R298
2007-001292 R-CHIP
33ohm,5%,1/16W,TP,1005
1
SNA
R299
2007-001292 R-CHIP
33ohm,5%,1/16W,TP,1005
1
SNA
R300
2007-001292 R-CHIP
33ohm,5%,1/16W,TP,1005
1
SNA
R377
2007-001292 R-CHIP
33ohm,5%,1/16W,TP,1005
1
SNA
R378
2007-001292 R-CHIP
33ohm,5%,1/16W,TP,1005
1
SNA
R380
2007-001292 R-CHIP
33ohm,5%,1/16W,TP,1005
1
SNA
R427
2007-001292 R-CHIP
33ohm,5%,1/16W,TP,1005
1
SNA
R413
2007-000157 R-CHIP
47Kohm,5%,1/16W,TP,1005
1
SNA
R404
2007-007642 R-CHIP
12.1ohm,1%,1/16W,TP,1005
1
SNA
R504
2007-007642 R-CHIP
12.1ohm,1%,1/16W,TP,1005
1
SNA
R527
2007-007642 R-CHIP
12.1ohm,1%,1/16W,TP,1005
1
SNA
SUB MATERIAL
BA99-07565A ASSY SUB/MATERIAL-NP_SMT
N/P,SMT SUB/MATERIAL,RIBBON,SOLVENT,BOND,-
1
SNA
0.6 SMT
0202-001499 SOLDER-WIRE FLUX
SR34 SUPER LFM-48,-,D0.6,96.5Sn/3Ag/0.5Cu,Flux_3.5%
1
SNA
SOLDER CREAM
0202-001461 SOLDER-CREAM
NP303-LD155-GQ,-,D38~10UM,96.5SN/3AG/0.5CU,FLUX
4
SNA
METAL MASK SOLVENT
0204-000199 SOLVENT
SUPANUKE-20,I.P.A,98%,-
0.001
SNA
ABLE BOND
0201-001002 ADHESIVE-TS
8380,SIL,9000CPS,10cc
0.001
SNA
PART ADHESIVE
0201-000160 ADHESIVE-TS
D520,NTR,-
0.001
SNA
SOLDER CREAM
0202-001520 SOLDER-CREAM
LFM-48X TM-HP,-,D25-45um,96.5Sn/3Ag/0.5Cu,Flux 12.0%
4
SNA
ART PAPER
BA68-40012N LABEL-LOCATION
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
1
SNA
MICOM LABEL
BA68-40012N LABEL-LOCATION
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
1
SNA
SMT LABEL
BA68-40012N LABEL-LOCATION
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
1
SNA
EC22
2402-001168 C-POLYMER AL CHIP
330uF,20%,2.5V,WT,TP,7.3*4.3*1.8mm,-
1
SNA
EC7
2402-001168 C-POLYMER AL CHIP
330uF,20%,2.5V,WT,TP,7.3*4.3*1.8mm,-
1
SNA
Q21
0505-001352 FET-SILICON
Si4894BDY,N,30V,8.9A,0.011ohm,1.4W,SO-8
1
SNA
Q22
0505-001352 FET-SILICON
Si4894BDY,N,30V,8.9A,0.011ohm,1.4W,SO-8
1
SNA
Q1
0505-002169 FET-SILICON
Si4435BDY-T1-E3,P,-30V,-9.1A,0.035ohm,2.5W,SO-8
1
SNA
Q7
0505-002169 FET-SILICON
Si4435BDY-T1-E3,P,-30V,-9.1A,0.035ohm,2.5W,SO-8
1
SNA
MICOM
BA46-08309A S/W MICOM
OXFORD,-,SYSTEM,ALL,00LU,-,-
1
SNA
R319
2007-008429 R-CHIP
499ohm,1%,1/16W,TP,1005
1
SNA
R536
2007-008429 R-CHIP
499ohm,1%,1/16W,TP,1005
1
SNA
R525
2007-007942 R-CHIP
1Mohm,1%,1/16W,TP,1005
1
SNA
R520
2007-008007 R-CHIP
3.24Kohm,1%,1/10W,TP,1608
1
SNA
R519
2007-008400 R-CHIP
453ohm,1%,1/10W,TP,1608
1
SNA
R316
2007-007226 R-CHIP
49.9ohm,1%,1/10W,TP,1608
1
SNA
R498
2007-007226 R-CHIP
49.9ohm,1%,1/10W,TP,1608
1
SNA
R506
2007-007226 R-CHIP
49.9ohm,1%,1/10W,TP,1608
1
SNA
R376
2007-002425 R-CHIP
1ohm,5%,1/10W,TP,1608
1
SNA
R349
2007-007697 R-CHIP
2.4Kohm,1%,1/16W,TP,1005
1
SNA
R321
2007-008359 R-CHIP
3.01Kohm,1%,1/16W,TP,1005
1
SNA
C31
2203-006336 C-CER,CHIP
10000nF,10%,25V,X5R,3216
1
SNA
C32
2203-006336 C-CER,CHIP
10000nF,10%,25V,X5R,3216
1
SNA
C55
2203-000489 C-CER,CHIP
2.2nF,10%,50V,X7R,1005
1
SNA
Summary of Contents for P560
Page 2: ......
Page 4: ...Contents...
Page 177: ...4 27 4 Troubleshooting This Document can not be used without Samsung s authorization...
Page 178: ...4 28 4 Troubleshooting This Document can not be used without Samsung s authorization...
Page 186: ...7 4 7 System Wire Diagram This Document can not be used without Samsung s authorization...