Reference Information
Samsung Electronics
3-3
3-2-2. Tools for Chip Replacement
The tools for chip replacement are as follows:
· Thin tip type soldering iron.
· Small flat-blade tip type soldering iron
· Special desoldering tip iron
· Air-blower Unit
· Flat Package Pick-up
· Flux that can be cleaned by water
· 0.3mm thin solder that can be cleaned by water
· Desoldering wire
· Tweezers
3-2-3. Chip Resistor and Chip Capacitors
TYPES
The types of chip resistors and chip capacitor are as
follows:
· Thick Film Chip Resistors
· Carbon Film Chip Resisters
· Metal Film Chip Resisters
· Chip Ceramic Capacitors
· Chip Trimming Resisters
REMOVING
1. Using Two soldering irons:
a. Use thin tip soldering irons
b. Use soldering tip temperature of about 280
o
C.
c. Simultaneously heat both ends of the part.
d. While heating, grasp the part with the tips of the
soldering irons and remove it.
e. Use desoldering wire to completely remove the
old solder from the part location on the board. A
clean pattern for installing the new part is very
INSTALLING
1. Clean the area where the new part is to be mount-
ed.
2. Apply a water soluble flux.
3. Set part correctly into position and prevent is from
shifting.
4. Bring the soldering iron tip close to the part contact
without actually touching it. Melt thin (0.3mm) sol-
der between the tip and part so that it flows into
the part contact.
5. Check work quality with a magnifying lens.
3-2-4. Chip Tantalum Capacitors and
Chip filters
TYPES
The types of chip tantalum capacitors and chip filters
are as follows:
· Chip Inductors
· Chip Tantalum Capacitors
· Chip Tantalum Electrolytic Capacitors
· Chip Aluminum Electrolytic Capacitors
· Chip Transformers
· Chip Filters
REMOVING
1. Using a special desoldering iron:
a. Select soldering tip according to part size.
b. Bring the tip into contact with the solder points.
c. When the solder melts, remove the part.
d. Remove the old solder with desoldering wire.
2. Using a special desoldering iron:
a. Use small flat-blade tips.
b. Heat both ends of the part simultaneously.
c. When the solder melts, grasp and remove the
part with the soldering iron tips.
Summary of Contents for ML-6050
Page 2: ... Samsung Electronics Co Ltd Mar 1999 Printed in Korea P N JC68 00072A Rev 1 00 ELECTRONICS ...
Page 12: ...Reference Information 3 8 Samsung Electronics Memo ...
Page 32: ...Disassembly and Reassembly 4 18 Samsung Electronics Memo ...
Page 138: ...Schematic Diagrams 8 17 Samsung Electronics 8 4 Flash SIMM ...