Samsung Electronics
Service Manual
Precautions
1-4
1.3 ESD Precautions
Certain semiconductor devices can be easily damaged by static electricity. Such components are commonly called
“Electrostatically Sensitive (ES) Devices”, or ESDs. Examples of typical ESDs are: integrated circuits, some field
effect transistors, and semiconductor “chip” components.
The techniques outlined below should be followed to help reduce the incidence of component damage caused by
static electricity.
Caution >>Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
1. Immediately before handling a semiconductor component or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known earth ground. Alternatively, employ a commercially avail-
able wrist strap device, which should be removed for your personal safety reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ESDs, place the assembly on a conductive surface, such
as aluminum or copper foil, or conductive foam, to prevent electrostatic charge buildup in the vicinity of the
assembly.
3. Use only a grounded tip soldering iron to solder or desolder ESDs.
4. Use only an “anti-static” solder removal device. Some solder removal devices not classified as “anti-static” can
generate electrical charges sufficient to damage ESDs.
5. Do not use Freon-propelled chemicals. When sprayed, these can generate electrical charges sufficient to dam-
age ESDs.
6. Do not remove a replacement ESD from its protective packaging until immediately before installing it. Most
replacement ESDs are packaged with all leads shorted together by conductive foam, aluminum foil, or a compa-
rable conductive material.
7. Immediately before removing the protective shorting material from the leads of a replacement ESD, touch the
protective material to the chassis or circuit assembly into which the device will be installed.
8. Maintain continuous electrical contact between the ESD and the assembly into which it will be installed, until
completely plugged or soldered into the circuit.
9. Minimize bodily motions when handling unpackaged replacement ESDs. Normal motions, such as the brushing
together of clothing fabric and lifting one’s foot from a carpeted floor, can generate static electricity sufficient to
damage an ESD.
Summary of Contents for ML-2510 series
Page 29: ...System Overview Samsung Electronics Service Manual 3 15 3 2 3 5 SPGPv3 Internal Block Diagram ...
Page 103: ...Exploded Views Parts List 7 2 Frame Assembly 0 15 13 12 4 14 3 2 16 5 7 6 16 1 9 11 10 8 ...
Page 106: ...Exploded Views Parts List 7 5 RX_Drive 0 6 3 4 9 10 8 7 11 2 5 ...
Page 115: ...Service Manual Block diagram 8 2 Samsung Electronics 8 2 ML 2570 2571N H W Block Diagram ...
Page 117: ...Service Manual Connection Diagram 9 2 9 2 ML 2570 2571N Connection Diagram ...