ML7404 Family LSIs
Hardware Design Manual
FEXL7404DG-03
i
Notes
1)
The information contained herein is subject to change without notice.
2)
Although LAPIS Semiconductor is continuously working to improve product reliability and quality,
semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal
injury or fire arising from failure, please take safety measures such as complying with the derating characteristics,
implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. LAPIS
Semiconductor shall have no responsibility for any damages arising out of the use of our Products beyond the
rating specified by LAPIS Semiconductor.
3)
Examples of application circuits, circuit constants and any other information contained herein are provided only to
illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account
when designing circuits for mass production.
4)
The technical information specified herein is intended only to show the typical functions of the Products and
examples of application circuits for the Products. No license, expressly or implied, is granted hereby under any
intellectual property rights or other rights of LAPIS Semiconductor or any third party with respect to the
information contained in this document; therefore LAPIS Semiconductor shall have no responsibility whatsoever
for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.
5)
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer
systems, gaming/entertainment sets) as well as the applications indicated in this document.
6)
The Products specified in this document are not designed to be radiation tolerant.
7)
For use of our Products in applications requiring a high degree of reliability (as exemplified below), please
contact and consult with a LAPIS Semiconductor representative: transportation equipment (i.e. cars, ships, trains),
primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers,
solar cells, and power transmission systems.
8)
Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear
power control systems, and submarine repeaters.
9)
LAPIS Semiconductor shall have no responsibility for any damages or injury arising from non-compliance with the
recommended usage conditions and specifications contained herein.
10)
LAPIS Semiconductor has used reasonable care to ensure the accuracy of the information contained in this
document. However, LAPIS Semiconductor does not warrant that such information is error-free and LAPIS
Semiconductor shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
11)
Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS
Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. LAPIS
Semiconductor shall have no responsibility for any damages or losses resulting non-compliance
with any applicable laws or regulations.
12)
When providing our Products and technologies contained in this document to other countries, you must abide by
the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation
the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.
13)
This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS
Semiconductor.
Copyright 2018 LAPIS Semiconductor Co., Ltd.
2-4-8 Shinyokohama, Kouhoku-ku,
Yokohama 222-8575, Japan
http://www.lapis-semi.com/en/
