RadiSys PL35Q, Product Manual, Page: 12 / 72

2
Product Specification
12
I/O shield
Figure 4. I/O shield for the PL35Q motherboard
Thermal specifications
When designing a custom thermal solution, it is helpful to know the Q35 motherboard thermal
requirements, such as the thermal design power (TDP) of the processor (see
Processor on
page 25).
It is recommended that you perform thermal tests under the maximum ambient temperature,
55ºC. Suitable airflow is required to maintain an ambient temperature that does not exceed the
maximum thermal performance for each processor and its thermal solution.
W
ARNING
!
Always test the final system configuration to ensure the ambient temperature does
not exceed the maximum. Failure to do so can lead to unstable operation, motherboard or
processor damage, and shortened life.
Electrical specifications
Motherboard power consumption
The Q35 motherboards support soft-switched and hard-switched ATX power supplies via a
standard 24-pin ATX power connector for main power supplies, and an extra 4-pin 12V ATX
power connector for CPU use. For information about power supply selections, see
General
specifications on page 21.
Power consumption is highly dependent on the processor, memory, devices attached, running
software, and the power state that the motherboard is in. Based on measurements of a real
system, the following examples show the power requirements to expect under select
conditions. They should not be interpreted as maximum requirements.
6.50
45.72
0.00
0.00
17.50
28.50
3.81
12.32
23.32
5.00
20.88
6.50
21.74
4.13
12.63
21.13
29.63
6.59
61.91 83.43 153.67 198.17 173.35 119.90
MB ZERO-POINT MOUNTING HOLE
MB MOUNTING HOLES
MB