LTE-A Module Series
EG18 Hardware Design
EG18_Hardware_Design 92 / 104
The following figure shows the corresponding position of the eight temperature sensors of the EG18.
Figure 48: Temperature Sensor Distribution
1. Make sure that the PCB design provides sufficient cooling solutions for the module: proper mounting,
heatsinks, and active cooling may be required depending on the integrated application.
2. For more detailed guidelines on thermal design, please refer to
document [8]
.
NOTES
