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LTE-A Module Series
EG18 Hardware Design
EG18_Hardware_Design 16 / 104
1.
“*” means under development.
2.
1)
Within operating temperature range, the module is 3GPP compliant.
3.
2)
Within extended temperature range, proper mounting, heating sinks and active cooling may be
required to make certain functions of the module such as voice, SMS, data transmission to be
realized. Only one or more parameters like Pout might reduce in their value and exceed the specified
tolerances. When the temperature returns to normal operating temperature levels, the module will
meet 3GPP specifications again.
2.3. Functional Diagram
The following figure shows a block diagram of EG18 and illustrates the major functional parts.
Power management
Baseband
LPDDR2 SDRAM+NAND Flash
Radio frequency
Peripheral interfaces
PMIC
Transceiver
NAND Flash
LPDDR2 SDRAM
Tx/Rx Blocks
ANT_DIV
ANT_MAIN
ANT_MIMO2
VBAT_BB
VBAT_RF
ET/APT
PWRKEY
ADCs
VDD_EXT
USB2.0/3.0 USIMx2 PCM
UART
I2C
RESET_N
38.4M
XO
STATUS
GPIOs
Control
QLINK
Control
Tx
PRx
DRx
Baseband
PCIe*
I2S_MCLK
SDIO*
BT_UART/SPI
ANT_GNSS
ANT_MIMO1
VDD_RF
Figure 1: Functional Diagram
NOTES