LPWA Module Series
BG770A-GL Hardware Design
BG770A-GL_Hardware_Design 74 / 75
Table 42: Recommended Thermal Profile Parameters
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
8.3. Packaging
BG770A-GL is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened
until the devices are ready to be soldered onto the application.
The following figures show the packaging details, measured in millimetre (mm).
Factor
Recommendation
Soak Zone
Max slope
1 to 3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70 to 120 s
Reflow Zone
Max slope
2 to 3 °C/s
Reflow time (D: over 220 °C)
45 to 70 s
Max temperature
238 to 246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle
1
NOTE
