LTE Module Series
EG25-G Hardware Design
EG25-G_Hardware_Design 83 / 100
1.
The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115°C. Therefore, the
thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105°C. Customers can execute
AT+QTEMP
command and get the
maximum BB chip temperature from the first returned value.
2.
For more detailed guidelines on thermal design, please refer to
document [7]
.
NOTES
