LTE Standard Module Series
EC200U_Series_Hardware_Design 48 / 94
MIC_P
Differential
layout
Module
10 pF
33 pF
33 pF
33 pF
GND
GND
Electret
Microphone
GND
GND
10 pF
10 pF
GND
GND
ESD
ESD
Close to Module
MIC_N
GND
GND
Close to
Microphone
0603
0603
0603
0603
0603
0603
33 pF
0603
33 pF
0603
33 pF
0603
10 pF
0603
10 pF
0603
10 pF
0603
Figure 23: Reference Circuit of Microphone Interface
MIC channel is sensitive to ESD, so it is not recommended to remove the ESD components used for
protecting the MIC.
3.14.3. Loudspeaker Interface Circuit
LOUDSPK_N
0R
0R
LODUSPK_P
8
Ω
Module
GND
GND
GND
Close to Speaker
10 pF
33 pF
33 pF
10 pF
10 pF
33 pF
GND
GND
GND
Differential
layout
0603
0603
0603
0603
0603
0603
ESD
ESD
Figure 24: Reference Circuit of Loudspeaker Interface
NOTE