Reference
MVI46-PDPMV1 ♦ SLC Platform
User Manual
PROFIBUS DPV1 Master
Page 112 of 160
ProSoft Technology, Inc.
March 25, 2011
6.1
Product Specifications
The PROFIBUS DPV1 Master module is a powerful communication interface for
Rockwell Automation
®
SLC
®
processors. Developed under license from Rockwell
Automation, the module incorporates proprietary backplane technology that
enables powerful data exchange with SLC processors.
The module supports complete Master specifications according to IEC 61158.
Acyclic parameter data can be transferred with Class 1 or Class 2 DPV1
services, allowing processors to easily communicate with slave devices
supporting PROFIBUS DPV0/V1 protocol.
The module acts as an input/output module between the PROFIBUS network
and the SLC processor. Data transfer from the processor is asynchronous with
the I/O data transfer on the PROFIBUS network.
6.1.1 General Specifications
Single slot - 1746 backplane compatible (local or extended I/O rack only -
remote rack not supported)
The module is recognized as an Input/Output module and has access to
processor memory for data transfer between processor and module using
M0/M1 files
Ladder Logic is used for data transfer between module and processor.
Sample ladder file included
6.1.2 Hardware Specifications
Specification
Description
Form Factor
Single-slot SLC chassis compatible
Backplane current load
800 mA @ 5 V
Operating Temperature
0°C to 60°C (32°F to 140°F)
Storage Temperature
-40°C to 85°C (-40°F to 185°F)
Shock
30 g operational; 50 g non-operational
Relative Humidity
5% to 95% (with no condensation)
Processor
Compatible with Rockwell Automation SLC 5/02
M0/M1 capable processors or newer
LED indicators
Module status, Backplane transfer status,
Application status, Serial activity and error LED
status
