EN 18
4.
LX9000R
Dismantling Instructions
Po
w
er Supply secondar
y
picture 20
picture 21
picture 22
Dismantling the
support frame of the Power secondary Board
• Dismantle the Power secondary Board as described before.
• Loosen 2 screws from the component side of the board.
• Release 3 catches as shown in picture 21.
• Turn the released part of the support frame away as shown in
picture 22.
The printed circuit board will now automaticly be released on the
rear edges and can be taken off.
Dismantling the
Power secondary Board
• Dismantle MDM- and ASP Board (as described before) first.
• Unplug headphone cable from ASP Board and put it out from the
catches on the Power secondary support frame.
• Release all cables on top
→
see picture 17
• Release cable to Amplifier Board from the catches on the rear
side of the support frame.
• Remove contact springs and cable ties as shown in picture 18 and
give cables a proper free length for dismantling.
• Remove 3 screws as shown in picture 19
• Raise the board up and put it to a desired service position
→
see
picture 20
picture 18
cable ties
picture 19
picture 17
move out all wires
Summary of Contents for LX9000R/22
Page 58: ...Diagnostic Software DVD EN 58 LX9000R 5 ...
Page 108: ...EN 108 7 LX9000R Circuit Diagrams and PWB Layouts DVIO BOARD top view ...
Page 109: ...EN 109 7 LX9000R Circuit Diagrams and PWB Layouts DVIO BOARD top view ...
Page 110: ...EN 110 7 LX9000R Circuit Diagrams and PWB Layouts DVIO BOARD top view ...
Page 111: ...EN 111 7 LX9000R Circuit Diagrams and PWB Layouts TEST POINTS OVERVIEW DVIO BOARD ...
Page 151: ...Circuit IC descriptions and list of abbreviations EN 151 LX9000R 9 Figure 9 11 ...
Page 152: ...Circuit IC descriptions and list of abbreviations EN 152 LX9000R 9 Figure 9 12 ...
Page 156: ...Circuit IC descriptions and list of abbreviations EN 156 LX9000R 9 IC7411 ...
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Page 185: ...Circuit IC descriptions and list of abbreviations EN 185 LX9000R 9 IC7431 uPD72893 ...
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