2-1
2-1
DISMANTLING INSTRUCTIONS
1) Loosen 4 screws to remove the Cover Top of the set.
2) Loosen 2 screws to remove the Panel Left and 2 screws
to remove the Panel Right of the set.
3) Slide out the CDC Tray as shown in the diagram below with
the help of a flat head screw driver.
Dismantling of the CDC Module and Front Panel
Remove CDC Module
4) Remove the Cover Tray CDC as indicated.
Front View CDC
Remove Cover Tray CDC
Dismantling of the CDC Module and Front Panel
Sliding Out The CDC Tray
5) Loosen 2 screws A and 2 screws B to remove the CDC
Module as indicated.
6) Remove 2 screws at the bottom to separate the
Front Panel Assembly from the Plate Bottom .
Summary of Contents for FWM583
Page 10: ...74HCT04D HEF4013BT 4 1 4 1 SET BLOCK DIAGRAM ...
Page 11: ...4 2 4 2 SET WIRING DIAGRAM ...
Page 12: ...5 1 5 1 PCB LAYOUT FRONT BOARD TOP VIEW ...
Page 13: ...5 2 5 2 PCB LAYOUT FRONT BOARD BOTTOM VIEW ...
Page 16: ...6 1 6 1 PCB LAYOUT MCU BOARD TOP VIEW ...
Page 17: ...6 2 6 2 PCB LAYOUT MCU BOARD BOTTOM VIEW ...
Page 20: ...9 1 9 1 LAYOUT DIAGRAM MAINS BOARD TOP VIEW ...
Page 25: ...8 2 8 2 LAYOUT DIAGRAM CD BOARD TOP VIEW ...
Page 26: ...8 3 8 3 LAYOUT DIAGRAM CD BOARD BOTTOM VIEW ...
Page 29: ...9 1 9 1 LAYOUT DIAGRAM MAINS BOARD TOP VIEW ...
Page 30: ...9 2 9 2 CIRCUIT DIAGRAM MAINS BOARD ...
Page 31: ...9 3 9 3 LAYOUT DIAGRAM MIC BOARD TOP VIEW LAYOUT DIAGRAM MIC BOARD BOTTOM VIEW ...
Page 33: ...10 1 10 1 LAYOUT DIAGRAM HIGH AMP USB JACK BOARD TOP VIEW ...
Page 34: ...10 2 10 2 LAYOUT DIAGRAM HIGH AMP USB JACK BOARD BOTTOM VIEW ...
Page 35: ...10 3 10 3 LAYOUT DIAGRAM POWER BOARD TOP VIEW ...
Page 36: ...10 4 10 4 LAYOUT DIAGRAM POWER BOARD BOTTOM VIEW ...
Page 37: ...CIRCUIT DIAGRAM HIGH AMP BOARD POWER BOARD 10 3 10 3 ...
Page 41: ...12 4 12 4 SOURCE SELECTION SOUND PROCESSING CIRCUIT ...
Page 42: ...12 5 12 5 HEADPHONE AMPLIFIER I2 C EXPANDER CIRCUIT 1K ...