3
1 Introduction................................................................................. 5
1.1
Content of this Document ................................................................... 5
1.2
Target Group, Personnel...................................................................... 5
1.3
Symbols Used ...................................................................................... 5
2 Product Specifications............................................................... 7
2.1
Overview and Application ................................................................... 7
2.2
Modes of Operation ............................................................................. 7
2.3
Hazardous Area Installation and Use............................................... 10
3 Installation and Commissioning ............................................. 12
3.1
Mounting and Dismounting............................................................... 12
3.2
Hardware Installation......................................................................... 13
3.2.1
R8D0-MIO* Cable and Connection Information ............................... 13
3.2.2
F2 Housing Degree of Protection..................................................... 16
3.2.3
Grounding and Shielding ................................................................. 19
3.2.4
Dip Switch Settings.......................................................................... 22
3.3
Firmware Download ........................................................................... 22
3.4
Commissioning in Valve Coupler Mode........................................... 23
3.5
Commissioning in Binary Input Mode ............................................. 26
3.6
Commissioning in Frequency or Counter Mode............................. 26
4 Parameterization and Operation ............................................. 28
4.1
Introduction ........................................................................................ 28
4.2
Prerequisites ...................................................................................... 29
4.3
Device Identification .......................................................................... 30
4.4
Commissioning Procedure ............................................................... 30
