6.4 Thermal integration guidelines (TBC)
The local maximum ambient air temperature (T
dissipation system (example: heatsink)
(
θ
sa is the thermal resistance thermal dissipation system to ambient)
Thermal interface materials (TIM), which are used between the thermal dissipation system and the
interface casing, can be of many kinds, i
materials, and special thermoplastic adhesives.
Thermal dissipation system can be attached directly to the interface casing with using M3 hole
fixation on the top of casing.
7
Available Tools
7.1 Workbench
Confidential Information
Thermal integration guidelines (TBC)
The local maximum ambient air temperature (T
amb max
= 85°C) can be supported by thermal
heatsink) with:
θθθθ
sa
≤≤≤≤
1 °C/W
thermal resistance thermal dissipation system to ambient)
Thermal interface materials (TIM), which are used between the thermal dissipation system and the
interface casing, can be of many kinds, including greases, gels, adhesives, tapes, silicon rubber
materials, and special thermoplastic adhesives.
Thermal dissipation system can be attached directly to the interface casing with using M3 hole
34/39
Ref: OEM-2012-149
= 85°C) can be supported by thermal
Thermal interface materials (TIM), which are used between the thermal dissipation system and the
ncluding greases, gels, adhesives, tapes, silicon rubber
Thermal dissipation system can be attached directly to the interface casing with using M3 hole
