REMOVAL
1. Put the Masking Tape (cotton tape) around the Flat Package IC to
protect other parts from any damage. (Refer to
Fig. 3-1
.)
NOTE
Masking is carried out on all the parts located within 10 mm distance from IC leads.
Fig. 3-1
2. Heat the IC leads using a blower type IC desoldering machine.
(Refer to
Fig. 3-2
.)
NOTE
Do not add the rotating and the back and forth directions force on the IC, until IC can move back
and forth easily after desoldering the IC leads completely.
Fig. 3-2
3. When IC starts moving back and forth easily after desoldering
completely, pickup the corner of the IC using a tweezers and
remove the IC by moving with the IC desoldering machine. (Refer
to
Fig. 3-3
.)
NOTE
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