
(266°F ~ 302°F)
(130°C ~150°C) for about 2 minutes.
Note:
A. Leadless components must not be reused after removal.
B. Excessive mechanical stress and rubbing of the component
electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers and alternately
apply heat to both electrodes. When the solder on both electrodes
is melted, remove the leadless component with a twisting motion.
Note:
A. Do not attempt to lift the component off the board until the
component is completely disconnected from the board by a
twisting action.
B. Be careful not to break the copper foil on the printed circuit
board.
Fig. 8-1
3. Installing the leadless component
A. Presolder the contact points on the circuit board.
Fig. 8-2
B. Press the part downward with tweezers and solder both
electrodes as shown below.
Fig. 8-3
Note:
Do not glue the replacement leadless component to the circuit
Summary of Contents for OmniVision PV-QV200
Page 24: ...5 2 2 Inner Parts Location Fig J1 1 ...
Page 25: ...5 2 3 EJECT Position Confirmation Fig J1 2 ...
Page 26: ...5 2 4 Grounding Plate Unit Full Erase Head and Cylinder Unit Fig J2 1 ...
Page 40: ...5 3 CASSETTE UP ASS Y SECTION 5 3 1 Top Plate Wiper Arm Unit and Holder Unit Fig K1 1 ...
Page 86: ...10 2 MECHANISM BOTTOM SECTION ...
Page 87: ...10 3 CASSETTE UP COMPARTMENT SECTION ...
Page 88: ...10 4 CHASSIS FRAME AND CASING PARTS SECTION ...
Page 89: ...10 5 PACKING PARTS AND ACCESSORIES SECTION ...
Page 117: ...R3036 ERJ6GEYJ122V MGF CHIP 1 10W 1 2K ...
Page 123: ...ECKATS101MB CERAMIC 20 250V 100P ...